Category:Kai MINAMIZAKI

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Kai MINAMIZAKI

Executive Summary

Kai MINAMIZAKI is an inventor who has filed 3 patents. Their primary areas of innovation include Mechanical treatment, e.g. grinding, polishing, cutting {( (3 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as DISCO CORPORATION (3 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Kai MINAMIZAKI Monthly Patent Applications.png

Technology Areas

Kai MINAMIZAKI Top Technology Areas.png

List of Technology Areas

  • H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 3 patents
  • H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
  • H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 2 patents
  • H01L2224/80013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/8023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/80894 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/80948 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
  • H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 1 patents
  • H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general): 1 patents
  • H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

  • DISCO CORPORATION: 3 patents

Collaborators

Subcategories

This category has the following 3 subcategories, out of 3 total.

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