Category:Jihwan KIM

Jihwan KIM

Executive Summary

Jihwan KIM is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), {Foil-like cooling fins or heat sinks (being part of lead-frames (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (4 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/3672 ({Foil-like cooling fins or heat sinks (being part of lead-frames): 2 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/82 ({by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] (interconnection structure between a plurality of semiconductor chips): 1 patents
• H01L25/072 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4846 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49568 (Lead-frames {or other flat leads (): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 1 patents
• H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/473 (by flowing liquids {(): 1 patents
• H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 5 patents

Collaborators

• Oseob JEON (5 collaborations)
• Dongwook KANG (4 collaborations)
• Seungwon IM (4 collaborations)
• Olaf ZSCHIESCHANG (1 collaborations)
• Roveendra PAUL of Dublin CA (US) (1 collaborations)
• Klaus NEUMAIER (1 collaborations)
• Jerome TEYSSEYRE (1 collaborations)