Category:Jifeng Zhou

Jifeng Zhou

Executive Summary

Jifeng Zhou is an inventor who has filed 10 patents. Their primary areas of innovation include {using diodes as protective elements} (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Littelfuse Semiconductor (Wuxi) Co., Ltd. (10 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L27/0255 ({using diodes as protective elements}): 3 patents
• H01L29/66136 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/8613 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/861 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/747 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/66386 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L27/0262 ({including a PNP transistor and a NPN transistor, wherein each of said transistors has its base coupled to the collector of the other transistor, e.g. silicon controlled rectifier [SCR] devices}): 1 patents
• H01L27/0292 ({using a specific configuration of the conducting means connecting the protective devices, e.g. ESD buses}): 1 patents
• H01L29/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0649 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/0248 ({for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection}): 1 patents
• H01L29/0642 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0646 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49555 (Lead-frames {or other flat leads (): 1 patents
• H01L25/074 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49513 (Lead-frames {or other flat leads (): 1 patents
• H01L2224/40091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40499 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01047 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H02H9/041 ({using a short-circuiting device}): 1 patents

Companies

List of Companies

• Littelfuse Semiconductor (Wuxi) Co., Ltd.: 10 patents

Collaborators

• Glenda Zhang (5 collaborations)
• Lei He (4 collaborations)
• Boris Rosensaft (2 collaborations)
• Ulrich Kelberlau (2 collaborations)
• Lei Shi (2 collaborations)
• Xingchong Gu (1 collaborations)
• Chao Gao (1 collaborations)
• Tsung-Wen Mou (1 collaborations)