Category:JHIH-WEI LAI

JHIH-WEI LAI

Executive Summary

JHIH-WEI LAI is an inventor who has filed 2 patents. Their primary areas of innovation include Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/481 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/50 (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents
• H01L27/14618 ({Containers}): 1 patents
• H01L33/486 ({adapted for surface mounting}): 1 patents
• H01L33/60 (Reflective elements): 1 patents
• H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
• H01L2933/0058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents

Collaborators

• DEI-CHENG LIU (2 collaborations)
• CHIA-SHUAI CHANG (1 collaborations)
• MING-YEN PAN (1 collaborations)
• JIAN-YU SHIH (1 collaborations)
• SHIH-HAN WU (1 collaborations)