Category:Intel Corporation

1

• 17520768. POWER MANAGEMENT IN BATTERY POWERED COMMUNICATION DEVICE AND METHOD simplified abstract (Intel Corporation)
• 17521518. PROCESSOR INTERRUPT EXPANSION FEATURE simplified abstract (Intel Corporation)
• 17523711. CLADDING AND CONDENSATION FOR STRAINED SEMICONDUCTOR NANORIBBONS simplified abstract (Intel Corporation)
• 17790635. REGULATING COMMAND SUBMISSION TO A SHARED PERIPHERAL DEVICE (Intel Corporation)
• 17809297. CONCEPT FOR A TELEMETRY HUB FOR MICROSERVICES simplified abstract (Intel Corporation)
• 17809329. DIFFUSION CUT STRESSORS FOR STACKED TRANSISTORS simplified abstract (Intel Corporation)
• 17819329. Tunable bandpass low noise amplifier simplified abstract (Intel Corporation)
• 17819862. HARDWARE MECHANISM TO EXTEND MKTME PROTECTIONS TO SGX DATA OUTSIDE EPC simplified abstract (Intel Corporation)
• 17835854. HIGH DENSITY METAL LAYERS IN ELECTRODE STACKS FOR TRANSITION METAL OXIDE DIELECTRIC CAPACITORS simplified abstract (Intel Corporation)
• 17835863. INTERCONNECT VIA METAL-INSULATOR-METAL (MIM) FUSE FOR INTEGRATED CIRCUITRY simplified abstract (Intel Corporation)
• 17837732. TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS simplified abstract (Intel Corporation)
• 17838637. DUAL METAL SILICIDE FOR STACKED TRANSISTOR DEVICES simplified abstract (Intel Corporation)
• 17838646. SOURCE AND DRAIN CONTACTS FORMED USING SACRIFICIAL REGIONS OF SOURCE AND DRAIN simplified abstract (Intel Corporation)
• 17840029. CONCURRENTLY FETCHING INSTRUCTIONS FOR MULTIPLE DECODE CLUSTERS simplified abstract (Intel Corporation)
• 17840211. FPGA BASED PLATFORM FOR POST-SILICON VALIDATION OF CHIPLETS simplified abstract (Intel Corporation)
• 17840239. HARDWARE SOFTWARE COMMUNICATION CHANNEL TO SUPPORT DIRECT PROGRAMMING INTERFACE METHODS ON FPGA-BASED PROTOTYPE PLATFORMS simplified abstract (Intel Corporation)
• 17846086. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
• 17846109. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES AND MULTI-SIDE ROUTING simplified abstract (Intel Corporation)
• 17846129. PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
• 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
• 17846173. PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
• 17846303. SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
• 17846688. SELECTIVE PROVISIONING OF SUPPLEMENTARY MICRO-OPERATION CACHE RESOURCES simplified abstract (Intel Corporation)
• 17847111. TECHNOLOGIES FOR OVERLAY METROLOGY MARKS simplified abstract (Intel Corporation)
• 17847257. PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
• 17847282. PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
• 17847407. PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES simplified abstract (Intel Corporation)
• 17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
• 17847555. MOBILITY IMPROVEMENT IN GATE ALL AROUND TRANSISTORS BASED ON SUBSTRATE ORIENTATION simplified abstract (Intel Corporation)
• 17847559. GATE ALL AROUND TRANSISTORS ON ALTERNATE SUBSTRATE ORIENTATION simplified abstract (Intel Corporation)
• 17847625. SPUTTER TARGETS AND SOURCES FOR SELF-DOPED SOURCE AND DRAIN CONTACTS simplified abstract (Intel Corporation)
• 17847628. LOWER DEVICE ACCESS IN STACKED TRANSISTOR DEVICES simplified abstract (Intel Corporation)
• 17847652. STRESS-REDUCING DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)
• 17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)
• 17848059. INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE simplified abstract (Intel Corporation)
• 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)
• 17848142. IMPLICIT MEMORY CORRUPTION DETECTION FOR CONDITIONAL DATA TYPES simplified abstract (Intel Corporation)
• 17848246. MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS simplified abstract (Intel Corporation)
• 17848284. AUTOMATIC FUSION OF ARITHMETIC IN-FLIGHT INSTRUCTIONS simplified abstract (Intel Corporation)
• 17848607. ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE simplified abstract (Intel Corporation)
• 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
• 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
• 17848630. HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD simplified abstract (Intel Corporation)
• 17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation)
• 17848643. ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE simplified abstract (Intel Corporation)
• 17848660. VARACTOR DEVICE WITH BACKSIDE ELECTRICAL CONTACT simplified abstract (Intel Corporation)
• 17849207. MICROELECTRONIC DIE WITH TWO DIMENSIONAL (2D) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES IN AN INTERCONNECT STACK THEREOF simplified abstract (Intel Corporation)
• 17849351. CONTROL FLOW INTEGRITY TO PREVENT POTENTIAL LEAKAGE OF SENSITIVE DATA TO ADVERSARIES simplified abstract (Intel Corporation)
• 17849352. COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES simplified abstract (Intel Corporation)
• 17849557. TECHNOLOGIES FOR EXPANDED BEAM OPTICAL CONNECTOR simplified abstract (Intel Corporation)
• 17850044. RECONFIGURABLE VECTOR PROCESSING IN A MEMORY simplified abstract (Intel Corporation)
• 17850078. SELF-ASSEMBLED MONOLAYER ON A DIELECTRIC FOR TRANSITION METAL DICHALCOGENIDE GROWTH FOR STACKED 2D CHANNELS simplified abstract (Intel Corporation)
• 17850090. PERFORMING DISTRIBUTED PROCESSING USING DISTRIBUTED MEMORY simplified abstract (Intel Corporation)
• 17850623. STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH simplified abstract (Intel Corporation)
• 17850746. SEMICONDUCTOR STRUCTURE INCLUDING BARRIER LAYER BETWEEN ELECTRODE LAYER AND UNDERLYING SUBSTRATE simplified abstract (Intel Corporation)
• 17850769. FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING COMMON METAL GATES AND HAVING GATE DIELECTRICS WITH AN OPPOSITE POLARITY DIPOLE LAYER simplified abstract (Intel Corporation)
• 17850778. INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER STAPLE simplified abstract (Intel Corporation)
• 17850779. INTEGRATED CIRCUIT STRUCTURE WITH RECESSED SELF-ALIGNED DEEP BOUNDARY VIA simplified abstract (Intel Corporation)
• 17850782. SIGE:GAB SOURCE OR DRAIN STRUCTURES WITH LOW RESISTIVITY simplified abstract (Intel Corporation)
• 17851658. SELF-ALIGNED EMBEDDED SOURCE AND DRAIN CONTACTS simplified abstract (Intel Corporation)
• 17851739. MULTICORE SYNCHRONIZATION MECHANISM FOR TIME CRITICAL RADIO SYSTEMS simplified abstract (Intel Corporation)
• 17851957. INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER simplified abstract (Intel Corporation)
• 17851960. INTEGRATED CIRCUIT STRUCTURES HAVING AOI GATES WITH ROUTING ACROSS NANOWIRES simplified abstract (Intel Corporation)
• 17851967. INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE DRAM AND POWER DELIVERY simplified abstract (Intel Corporation)
• 17851968. LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND OPERATION OF SAME simplified abstract (Intel Corporation)
• 17851979. INTEGRATED CIRCUIT STRUCTURES HAVING INVERTERS WITH CONTACTS BETWEEN NANOWIRES simplified abstract (Intel Corporation)
• 17851985. INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY simplified abstract (Intel Corporation)
• 17851997. DEVICE, SYSTEM AND METHOD TO DELIVER POWER WITH PHASE CIRCUITS OF AN INTEGRATED CIRCUIT DIE simplified abstract (Intel Corporation)
• 17851999. MULTI-PATHWAY ROUTING VIA THROUGH HOLE simplified abstract (Intel Corporation)
• 17852016. 2D LAYERED GATE OXIDE simplified abstract (Intel Corporation)
• 17852028. SELECTIVE BOTTOMLESS GRAPHENE LINED INTERCONNECTS simplified abstract (Intel Corporation)
• 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)
• 17852189. HIERARCHICAL CORE VALID TRACKER FOR CACHE COHERENCY simplified abstract (Intel Corporation)
• 17883678. Real-Time Detection of Deflections and Ruptures of EUV Pellicle Membranes simplified abstract (Intel Corporation)
• 17883718. METHODS AND TOOLS FOR PREVENTING THE COUNTERFEITING AND TAMPERING OF SEMICONDUCTOR DEVICES simplified abstract (Intel Corporation)
• 17884755. CONCURRENT COMPUTE CONTEXT simplified abstract (Intel Corporation)
• 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation)
• 17886981. SPECULATING OBJECT-GRANULAR KEY IDENTIFIERS FOR MEMORY SAFETY simplified abstract (Intel Corporation)
• 17887154. MULTI-PORTED REGISTER FILE WITH CFETS simplified abstract (Intel Corporation)
• 17887273. SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS simplified abstract (Intel Corporation)
• 17887886. SWITCHED DIPLEXER FOR FREQUENCY SEPARATION simplified abstract (Intel Corporation)
• 17888090. CLOCK FREQUENCY MANAGEMENT OF MULTIPLE CIRCUITRIES simplified abstract (Intel Corporation)
• 17916748. VULNERABLE ROAD USER BASIC SERVICE COMMUNICATION PROTOCOLS FRAMEWORK AND DYNAMIC STATES simplified abstract (Intel Corporation)
• 17918507. TECHNIQUES FOR MANAGEMENT DATA ANALYTICS (MDA) PROCESS AND SERVICE simplified abstract (Intel Corporation)
• 17930801. FULL WAFER DEVICE WITH BACK SIDE PASSIVE ELECTRONIC COMPONENTS simplified abstract (Intel Corporation)
• 17930825. FULL WAFER DEVICE WITH FRONT SIDE PASSIVE ELECTRONIC COMPONENTS simplified abstract (Intel Corporation)
• 17930841. FULL WAFER DEVICE WITH BACK SIDE INTERCONNECTS AND WAFER-SCALE INTEGRATION simplified abstract (Intel Corporation)
• 17931007. PRIVACY PRESERVING DIGITAL PERSONAL ASSISTANT simplified abstract (Intel Corporation)
• 17931438. SECURE MULTIPARTY COMPUTE USING HOMOMORPHIC ENCRYPTION simplified abstract (Intel Corporation)
• 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
• 17933000. INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER simplified abstract (Intel Corporation)
• 17933331. COMPACT AND WIDEBAND BEAM-SWITCHING ANTENNA ARRAY ARCHITECTURE simplified abstract (Intel Corporation)
• 17933512. ANALOG-TO-DIGITAL CONVERTER, RECEIVER, BASE STATION, MOBILE DEVICE AND METHOD FOR A TIME-INTERLEAVED ANALOG-TO-DIGITAL CONVERTER simplified abstract (Intel Corporation)
• 17933589. HYBRID MANUFACTURING OF ACCESS TRANSISTORS FOR MEMORY simplified abstract (Intel Corporation)
• 17934580. Apparatus, Device, Method, and Computer Program for Extending Instructions Supported by a Processor simplified abstract (Intel Corporation)
• 17934581. A Concept for Orchestration of Microservices simplified abstract (Intel Corporation)
• 17936049. POST-QUANTUM LATTICE-BASED SIGNATURE LATENCY REDUCTION simplified abstract (Intel Corporation)
• 17936438. Scalable Digital Twin Services for intelligent transport systems (ITS) with Optimized Communication and Dynamic Resource Adaptation simplified abstract (Intel Corporation)
• 17936934. METAL GATE CUT FORMED AFTER SOURCE AND DRAIN CONTACTS simplified abstract (Intel Corporation)
• 17936952. FORKSHEET TRANSISTOR STRUCTURES WITH GATE CUT SPINE simplified abstract (Intel Corporation)
• 17936990. CAPACITOR STRUCTURE EMBEDDED WITHIN SOURCE OR DRAIN REGION simplified abstract (Intel Corporation)
• 17937043. FERROELECTRIC CAPACITOR WITHIN BACKSIDE INTERCONNECT simplified abstract (Intel Corporation)
• 17937212. FORMING METAL GATE CUTS USING MULTIPLE PASSES FOR DEPTH CONTROL simplified abstract (Intel Corporation)
• 17937229. SINGLE PRECISION SUPPORT FOR SYSTOLIC PIPELINE IN A GRAPHICS ENVIRONMENT simplified abstract (Intel Corporation)
• 17937252. HARDWARE ENHANCEMENTS FOR DOUBLE PRECISION SYSTOLIC SUPPORT simplified abstract (Intel Corporation)
• 17937258. ENCRYPTED PROCESSING UNIT EMULATED WITH HOMOMORPHIC ENCRYPTION CIRCUITS simplified abstract (Intel Corporation)
• 17937270. ORDERED THREAD DISPATCH FOR THREAD TEAMS simplified abstract (Intel Corporation)
• 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
• 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
• 17937894. ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract (Intel Corporation)
• 17938784. PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract (Intel Corporation)
• 17940049. BLUETOOTH REPORT EVENTS FOR ULTRA LOW LATENCY simplified abstract (Intel Corporation)
• 17940194. EPITAXIAL REGIONS EXTENDING BETWEEN INNER GATE SPACERS simplified abstract (Intel Corporation)
• 17940195. BARRIER LAYER FOR DIELECTRIC RECESS MITIGATION simplified abstract (Intel Corporation)
• 17940944. FIN TRIM PLUG STRUCTURES WITH METAL FOR IMPARTING CHANNEL STRESS simplified abstract (Intel Corporation)
• 17941960. SELECTIVE CHECKING FOR ERRORS simplified abstract (Intel Corporation)
• 17942392. CURRENT AND HEAT BALANCING CONSTANT VOLTAGE CHARGING simplified abstract (Intel Corporation)
• 17942415. DYNAMIC VOLTAGE AND FREQUENCY SCALING FOR MEMORY IN HETEROGENEOUS CORE ARCHITECTURES simplified abstract (Intel Corporation)
• 17942466. TECHNIQUES FOR A TRUSTED EXECUTION ENVIRONMENT AT A COMPUTE SERVER TO USE A REMOTE ACCELERATOR simplified abstract (Intel Corporation)
• 17942516. TEMPERATURE AND VOLTAGE INSENSITIVE CROSSTALK CANCELLATION simplified abstract (Intel Corporation)
• 17943354. TECHNOLOGIES FOR GLASS CORE INDUCTOR simplified abstract (Intel Corporation)
• 17943443. GATE CUTS IN A GRATING PATTERN ACROSS AN INTEGRATED CIRCUIT simplified abstract (Intel Corporation)
• 17943557. TRANSISTOR DEVICES WITH EXTENDED DRAIN simplified abstract (Intel Corporation)
• 17943812. DIODES WITH BACKSIDE CONTACT simplified abstract (Intel Corporation)
• 17943815. TARGETED SUB-FIN ETCH DEPTH simplified abstract (Intel Corporation)
• 17943819. WIDE CHANNEL DIODE STRUCTURE INCLUDING SUB-FIN simplified abstract (Intel Corporation)
• 17943840. TRANSISTOR DEVICES WITH INTEGRATED DIODES simplified abstract (Intel Corporation)
• 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
• 17944310. CHIPLET STATE AWARE AND DYNAMIC VOLTAGE REGULATOR EVENT HANDLING simplified abstract (Intel Corporation)
• 17944352. EFFICIENT SECURITY METADATA ENCODING IN ERROR CORRECTING CODE (ECC) MEMORY WITHOUT DEDICATED ECC BITS simplified abstract (Intel Corporation)
• 17944500. OFFSET SCALING IN LOAD/STORE MESSAGES simplified abstract (Intel Corporation)
• 17944542. MERGING ATOMICS TO THE SAME CACHE LINE simplified abstract (Intel Corporation)
• 17947071. FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES WITH LOW OPERATING VOLTAGE CAPABILITIES simplified abstract (Intel Corporation)
• 17948267. METHODS AND DEVICES FOR DETERMINATION OF AN UPDATE TIMESCALE FOR RADIO RESOURCE MANAGEMENT ALGORITHMS simplified abstract (Intel Corporation)
• 17948586. THIN FILM CAPACITORS simplified abstract (Intel Corporation)
• 17949258. CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF simplified abstract (Intel Corporation)
• 17949276. DRY FILM LAMINATION WITH DYNAMIC FEEDBACK CONTROL simplified abstract (Intel Corporation)
• 17949353. USER-LEVEL EXCEPTION-BASED INVOCATION OF SOFTWARE INSTRUMENTATION HANDLERS simplified abstract (Intel Corporation)
• 17949417. TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR simplified abstract (Intel Corporation)
• 17949803. HARDWARE PROCESSOR CORE HAVING A MEMORY SLICED BY LINEAR ADDRESS simplified abstract (Intel Corporation)
• 17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation)
• 17949861. INTEGRATED CIRCUIT STRUCTURES HAVING GATE CUT PLUG REMOVED FROM TRENCH CONTACT USING ANGLED DIRECTIONAL ETCH simplified abstract (Intel Corporation)
• 17949904. BASE PLUS OFFSET ADDRESSING FOR LOAD/STORE MESSAGES simplified abstract (Intel Corporation)
• 17949914. TEMPORAL GRADIENTS OF HIGHER ORDER EFFECTS TO GUIDE TEMPORAL ACCUMULATION simplified abstract (Intel Corporation)
• 17954372. INTELLIGENT AND ADAPTIVE MULTI-MODAL REAL-TIME SIMULTANEOUS LOCALIZATION AND MAPPING BASED ON LIGHT DETECTION AND RANGING AND CAMERA OR IMAGE SENSORS simplified abstract (Intel Corporation)
• 17955549. REAL-TIME SITUATIONAL PLANNING FOR PASSENGER TRANSPORT simplified abstract (Intel Corporation)
• 17955689. LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS simplified abstract (Intel Corporation)
• 17956188. ULTRA-LOW VOLTAGE TRANSISTOR CELL DESIGN USING GATE CUT LAYOUT simplified abstract (Intel Corporation)
• 17956296. TECHNOLOGIES FOR PEROVSKITE TRANSISTORS simplified abstract (Intel Corporation)
• 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
• 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
• 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)
• 17956485. REAL-TIME AUTONOMOUS SEAT ADAPTATION AND IMMERSIVE CONTENT DELIVERY FOR VEHICLES simplified abstract (Intel Corporation)
• 17956750. NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract (Intel Corporation)
• 17956753. DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract (Intel Corporation)
• 17956757. PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract (Intel Corporation)
• 17956760. SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract (Intel Corporation)
• 17956775. SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
• 17956779. INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS RECESSED FOR GATE CONTACT simplified abstract (Intel Corporation)
• 17956835. MULTI-PHASE SIGNAL GENERATION SCHEME AND METHOD THEREOF simplified abstract (Intel Corporation)
• 17956844. IN-MEMORY ANALOG CHANNEL EQUALIZATION simplified abstract (Intel Corporation)
• 17956950. MULTI-LINK OPERATION TRANSMIT ARCHITECTURE FOR DYNAMIC MAPPING OF TRANSMIT QUEUES TO LINKS simplified abstract (Intel Corporation)
• 17957003. HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract (Intel Corporation)
• 17957011. APPARATUS, SYSTEM, AND METHOD OF A MULTI-MODE POWER AMPLIFIER simplified abstract (Intel Corporation)
• 17957052. CHIP AND PLATFORM LEVEL POWER MONITORING AND SEQUENCING FOR ROBUST STARTUP AND MODE SWITCHING simplified abstract (Intel Corporation)
• 17957053. ACTIVE ELECTRONIC SIGNAL CROSSTALK CANCELLATION simplified abstract (Intel Corporation)
• 17957094. GLASS RECIRCULATOR FOR OPTICAL SIGNAL REROUTING ACROSS PHOTONIC INTEGRATED CIRCUITS simplified abstract (Intel Corporation)
• 17957106. ETCH STOP LAYER FOR METAL GATE CUT simplified abstract (Intel Corporation)
• 17957225. INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (Intel Corporation)
• 17957257. EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract (Intel Corporation)
• 17957339. Flexible Circuit for Real and Complex Filter Operations simplified abstract (Intel Corporation)
• 17957341. DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract (Intel Corporation)
• 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
• 17957355. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
• 17957359. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
• 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
• 17957486. DETERMINISTIC BROADCASTING FROM SHARED MEMORY simplified abstract (Intel Corporation)
• 17957529. HUMAN-ROBOT INTERACTIVE WORKSPACE simplified abstract (Intel Corporation)
• 17957552. BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS DURING WAFER CHUCKING simplified abstract (Intel Corporation)
• 17957560. HIGH ENDURANCE SUPER-LATTICE ANTI-FERROELECTRIC CAPACITORS simplified abstract (Intel Corporation)
• 17957580. SQUARE ETCH PROFILES IN HETEROGENOUS MATERIALS OF INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
• 17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation)
• 17957591. SELECTIVE FERROELECTRIC DEPLOYMENT FOR SINGLE-TRANSISTOR, MULTIPLE-CAPACITOR DEVICES simplified abstract (Intel Corporation)
• 17957600. HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract (Intel Corporation)
• 17957603. IMPROVED REPLACEMENT ELECTRODE PROCESS FOR 3D FERROELECTRIC MEMORY simplified abstract (Intel Corporation)
• 17957637. POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract (Intel Corporation)
• 17957721. INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MATERIALS simplified abstract (Intel Corporation)
• 17957751. HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract (Intel Corporation)
• 17957752. PHOTONICALLY STEERED IMPEDANCE SURFACE ANTENNAS simplified abstract (Intel Corporation)
• 17957761. SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS simplified abstract (Intel Corporation)
• 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)
• 17957821. GATE CUT, WITH ASYMMETRICAL CHANNEL TO GATE CUT SPACING simplified abstract (Intel Corporation)
• 17957836. FABRICATION OF RECONFIGURABLE ARCHITECTURES USING FERROELECTRICS simplified abstract (Intel Corporation)
• 17957887. STACKED SOURCE OR DRAIN CONTACT FLYOVER simplified abstract (Intel Corporation)
• 17957919. SEQUENCING CIRCUIT FOR A PROCESSOR simplified abstract (Intel Corporation)
• 17957926. INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Intel Corporation)
• 17957945. DEVICE, METHOD AND SYSTEM TO PROVIDE A RANDOM ACCESS MEMORY WITH A FERROELECTRIC RESISTIVE JUNCTION simplified abstract (Intel Corporation)
• 17957957. MEMORY ARRAY COMPRISING A FERROELECTRIC DATA STORAGE ELEMENT simplified abstract (Intel Corporation)
• 17957969. DEVICE, METHOD AND SYSTEM TO DETERMINE A MODE OF PROCESSOR OPERATION BASED ON PAGE TABLE METADATA simplified abstract (Intel Corporation)
• 17957978. DEVICE, METHOD, AND SYSTEM TO DETERMINE A COUNT OF RETIRED PREFETCH INSTRUCTIONS simplified abstract (Intel Corporation)