Category:Hiroshi MORIKAZU

Hiroshi MORIKAZU

Executive Summary

Hiroshi MORIKAZU is an inventor who has filed 7 patents. Their primary areas of innovation include taking account of the properties of the material involved (2 patents), Removing material ( (2 patents), Bombardment with radiation {( (2 patents), and they have worked with companies such as DISCO CORPORATION (7 patents). Their most frequent collaborators include (5 collaborations), (5 collaborations), (5 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• B23K26/40 (taking account of the properties of the material involved): 2 patents
• B23K26/364 (Removing material (): 2 patents
• H01L21/268 (Bombardment with radiation {(): 2 patents
• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 2 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 2 patents
• B23K26/0622 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
• B23K26/36 (Removing material (): 2 patents
• B23K26/082 (Devices involving relative movement between laser beam and workpiece): 1 patents
• B23K26/0665 (by using masks): 1 patents
• B23K2101/42 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/7813 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L21/6838 (for supporting or gripping (for conveying): 1 patents
• H01L2221/68386 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• DISCO CORPORATION: 7 patents

Collaborators

• Naotoshi KIRIHARA (5 collaborations)
• Yohei KANEKO (5 collaborations)
• Kentaro ODANAKA (5 collaborations)
• Yuki SUTO (2 collaborations)
• Tasuku KOYANAGI (2 collaborations)
• Masato TERAJIMA (2 collaborations)
• Junya MIMURA (2 collaborations)