Category:Hayato IGA

Hayato IGA

Executive Summary

Hayato IGA is an inventor who has filed 9 patents. Their primary areas of innovation include Mechanical treatment, e.g. grinding, polishing, cutting {( (6 patents), {Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses (6 patents), {Edge treatment, chamfering} (3 patents), and they have worked with companies such as DISCO CORPORATION (9 patents). Their most frequent collaborators include (7 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 6 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 6 patents
• H01L21/02021 ({Edge treatment, chamfering}): 3 patents
• B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 3 patents
• H01L21/268 (Bombardment with radiation {(): 2 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L22/20 ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps}): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• B32B38/0004 (Ancillary operations in connection with laminating processes): 1 patents
• B32B38/0012 (Ancillary operations in connection with laminating processes): 1 patents
• B32B41/00 (Arrangements for controlling or monitoring lamination processes; Safety arrangements): 1 patents
• H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 1 patents
• B32B2038/0016 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B2310/0843 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B26D5/007 (Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting): 1 patents
• B26D1/04 (having a linearly-movable cutting member (): 1 patents
• G01N21/9505 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms): 1 patents
• B23K26/083 (Devices involving relative movement between laser beam and workpiece): 1 patents
• B23K26/0869 (Devices involving relative movement between laser beam and workpiece): 1 patents
• G01N21/17 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms): 1 patents
• G01N21/8806 ({Specially adapted optical and illumination features}): 1 patents
• B23K2103/56 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• G01N2021/1736 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms): 1 patents
• B23K26/364 (Removing material (): 1 patents
• H01L21/67155 ({Apparatus for applying a liquid, a resin, an ink or the like (): 1 patents
• H01L21/67242 ({Apparatus for monitoring, sorting or marking (testing or measuring during manufacture): 1 patents
• H01L21/02016 ({Backside treatment}): 1 patents
• H01L21/68764 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents

Companies

List of Companies

• DISCO CORPORATION: 9 patents

Collaborators

• Kazuya HIRATA (7 collaborations)
• Yuichi KITAZUMI (1 collaborations)
• KwangYoung JUNG (1 collaborations)
• Kentaro IIZUKA (1 collaborations)
• Hironobu OZAWA (1 collaborations)
• Mato HATTORI (1 collaborations)
• Hideo IWATA (1 collaborations)
• Kazuma SEKIYA (1 collaborations)