Category:Hao-Yi Tsai

Hao-Yi Tsai

Executive Summary

Hao-Yi Tsai is an inventor who has filed 18 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (18 patents). Their most frequent collaborators include (7 collaborations), (5 collaborations), (5 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 5 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/5383 ({Multilayer substrates (): 4 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 4 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 3 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 3 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 3 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 3 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2225/1058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• G02B6/4251 (Coupling light guides with opto-electronic elements): 2 patents
• H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 2 patents
• H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/82 ({by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] (interconnection structure between a plurality of semiconductor chips): 2 patents
• H01L2224/82005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/92 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L25/162 (the devices being of types provided for in two or more different main groups of groups): 2 patents
• H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 2 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/81815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/02 ({Bonding areas (on insulating substrates, e.g. chip carriers,): 1 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L2224/02141 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0312 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05559 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0557 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05573 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06548 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06586 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/12002 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/12 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B2006/12061 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B2006/121 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L23/60 (Protection against electrostatic charges or discharges, e.g. Faraday shields): 1 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/585 ({comprising conductive layers or plates or strips or rods or rings (): 1 patents
• H01L2223/5442 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2223/54426 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/24137 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/24146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/24265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73209 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73217 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/82947 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/4243 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4214 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4239 (Coupling light guides with opto-electronic elements): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68345 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L2223/54433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/24227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/244 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73267 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/82106 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83191 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/92244 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19106 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/563 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• B23K26/352 (for surface treatment): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L2224/16145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/17179 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/17517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/26145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83007 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/92125 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13582 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 1 patents
• H01L23/3171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/33 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0231 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L31/0203 (Containers; Encapsulations {, e.g. encapsulation of photodiodes} (for photovoltaic devices): 1 patents
• H01L31/02002 ({Arrangements for conducting electric current to or from the device in operations}): 1 patents
• H01L31/024 (Arrangements for cooling, heating, ventilating or temperature compensation (for photovoltaic devices): 1 patents
• H01L31/1892 (Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof): 1 patents
• H01L2225/1041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/1094 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/95 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01R12/57 (surface mounting terminals): 1 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/14 ({of a plurality of bump connectors}): 1 patents
• H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 1 patents
• H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/95001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/2101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81201 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81862 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81193 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81906 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1403 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/14517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/14505 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1319 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0635 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/07025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13386 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05442 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13164 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16108 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16059 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13016 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1607 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8192 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/1131 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1427 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/14361 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1432 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 18 patents

Collaborators

• Tzuan-Horng Liu (7 collaborations)
• Tsung-Hsien Chiang (5 collaborations)
• Chung-Ming Weng (5 collaborations)
• Kuo-Lung Pan (5 collaborations)
• Tsung-Yuan Yu (4 collaborations)
• Chia-Hung Liu (4 collaborations)
• Mao-Yen Chang (4 collaborations)
• Yu-Chia Lai (4 collaborations)
• Cheng-Chieh Hsieh (3 collaborations)
• Tzu-Sung Huang (3 collaborations)
• Ming-Hung Tseng (3 collaborations)
• Hsiu-Jen Lin (3 collaborations)
• Chih-Hsuan Tai (3 collaborations)
• Kris Lipu Chuang (2 collaborations)
• Hung-Yi Kuo (2 collaborations)
• Hua-Kuei Lin (2 collaborations)
• Che-Hsiang Hsu (2 collaborations)
• Shih-Wei Chen (2 collaborations)
• Ching-Hua Hsieh (2 collaborations)
• Yen-Liang Lin (2 collaborations)
• Tin-Hao Kuo (2 collaborations)
• Chih-Hao Chang (2 collaborations)
• Chih-Wei Lin (2 collaborations)
• Chun-Cheng Lin (2 collaborations)
• Yu-Chih Huang (2 collaborations)
• Ban-Li Wu (2 collaborations)
• Ying-Cheng Tseng (2 collaborations)
• Po-Chun Lin (2 collaborations)
• Hui-Chun Chiang (1 collaborations)
• Cheng-Shiuan Wong (1 collaborations)
• Ting Hao Kuo (1 collaborations)
• Chen-Hua Yu (1 collaborations)
• Chung-Shi Liu (1 collaborations)
• Wei-Kang Hsieh (1 collaborations)
• Chu-Chun Chueh (1 collaborations)
• Pavithra Sriram (1 collaborations)
• Po-Yuan Teng (1 collaborations)
• Cheng-Chieh Wu (1 collaborations)
• Shu-Rong Chun (1 collaborations)
• Hsien-Ming Tu (1 collaborations)
• Chun-Ti Lu (1 collaborations)
• Yu-Hsiang Hu (1 collaborations)
• Bo-Jiun Lin (1 collaborations)
• Hung-Chun Cho (1 collaborations)
• Pei-Rong Ni (1 collaborations)
• Hsin-Wei Huang (1 collaborations)
• Zheng-Gang Tsai (1 collaborations)
• Tai-You Liu (1 collaborations)
• Po-Chang Shih (1 collaborations)
• Yu-Ting Huang (1 collaborations)
• Hsin-Yu Pan (1 collaborations)
• Yi-Da Tsai (1 collaborations)
• Hsaing-Pin Kuan (1 collaborations)
• Chih-Chiang Tsao (1 collaborations)
• Hsuan-Ting Kuo (1 collaborations)