Category:Hai-Hung Wen

Hai-Hung Wen

Executive Summary

Hai-Hung Wen is an inventor who has filed 3 patents. Their primary areas of innovation include Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns (2 patents), Microstructural systems; {Auxiliary parts of microstructural devices or systems} (2 patents), {Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture} (2 patents), and they have worked with companies such as xMEMS Labs, Inc. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H04R1/2811 (Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns): 2 patents
• B81B7/0061 (Microstructural systems; {Auxiliary parts of microstructural devices or systems}): 2 patents
• H04R1/025 ({Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture}): 2 patents
• B81B2201/0257 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
• B81B2203/0127 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
• H04R2201/003 (Mems transducers or their use (of the electrostatic type): 2 patents
• B81B2203/0307 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
• H04R7/04 (Plane diaphragms): 1 patents
• H04R19/00 (Electrostatic transducers): 1 patents
• H04R7/06 (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents
• H04R7/18 (at the periphery): 1 patents
• H04R31/003 ({for diaphragms or their outer suspension}): 1 patents
• B81C1/00158 (Manufacture or treatment of devices or systems in or on a substrate (): 1 patents
• B81B2203/01 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
• B81C2203/051 (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 1 patents
• H04R1/023 ({Screens for loudspeakers}): 1 patents
• H04R19/02 (Loudspeakers (): 1 patents

Companies

List of Companies

• xMEMS Labs, Inc.: 3 patents

Collaborators

• Chao-Yu Chen (3 collaborations)
• Wen-Chien Chen (3 collaborations)
• Chiung C. Lo of San Jose CA (US) (3 collaborations)
• Hao-Hsin Chang (1 collaborations)
• Chun-I Chang (1 collaborations)