Category:H01L23/528

H01L23/528 - IPC Classification

H01L23/528 is a specific classification within the International Patent Classification (IPC) system, which is used to categorize patents and patent applications according to the different areas of technology they pertain to. This classification addresses technologies in the domain of semiconductor devices, specifically focusing on:

• Semiconductor devices; Electric solid state devices not otherwise provided for

 * This category is part of a broader classification, H01L, which covers a wide range of semiconductor technologies and their manufacturing processes.

• Specific structural details of semiconductor devices

 * The classification highlights specialized structural features and configurations that are unique to semiconductor devices.

• Arrangements for cooling, heating, ventilating or temperature compensation

 * This subcategory focuses on the designs and methods used in managing the thermal aspects of semiconductor devices, which is critical for their efficiency and longevity.

• The subcategory 528 emphasizes on Mountings or securing means of detachable cooling or heating arrangements

 * This area is particularly concerned with the techniques and mechanisms used to attach cooling or heating elements to semiconductor devices. Efficient thermal management is crucial in semiconductor devices to ensure optimal performance and to prevent overheating, which can lead to device failure.

For a more detailed exploration of the patents and innovations classified under H01L23/528, one can refer to patent databases and resources that categorize inventions based on the IPC system. The innovations in this classification are pivotal in advancing semiconductor technology, ensuring devices operate within safe temperature ranges, thereby enhancing performance and durability.