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Category:H01L23/467
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Pages in category "H01L23/467"
The following 22 pages are in this category, out of 22 total.
1
- 17876813. Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)
- 18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18071399. ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT simplified abstract (Intel Corporation)
- 18149990. HEAT SINK WITH TURBULENT STRUCTURES simplified abstract (Google LLC)
- 18218322. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
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I
- Intel corporation (20240103073). COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR ELECTRON BEAM ANALYSIS simplified abstract
- Intel corporation (20240162158). PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract
- Intel corporation (20240175917). ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT simplified abstract
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on May 16th, 2024
- Intel Corporation patent applications on May 30th, 2024