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Category:H01G4/30
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Pages in category "H01G4/30"
The following 200 pages are in this category, out of 327 total.
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- 17589953. DIELECTRIC MATERIAL COMPRISING BISMUTH COMPOUND AND METHOD OF MAKING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17589955. DIELECTRIC MATERIAL COMPRISING LEAD COMPOUND AND METHOD OF MAKING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17750742. DIELECTRIC MATERIAL, DEVICE INCLUDING THE SAME, AND METHOD OF PREPARING THE DIELECTRIC MATERIAL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17858552. DIELECTRIC MATERIAL, DEVICE INCLUDING THE SAME, AND METHOD OF PREPARING THE DIELECTRIC MATERIAL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18114394. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18124713. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18127808. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18130965. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18131022. DIELECTRIC SLURRY COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT USING SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18132195. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18136418. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18138906. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18139444. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18143728. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18147503. SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (Intel Corporation)
- 18198533. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18209619. MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18213002. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18213005. ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18222087. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18224154. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18224669. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18224670. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18227563. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18229857. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18231324. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18235065. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18235067. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18235531. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD OF THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18243250. COMPOSITE ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18243928. COMPOSITE ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18330531. CAPACITOR HAVING CONDUCITVE PILLAR STRUCTURES CONFIGURED TO INCREASE CAPACITANCE DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18333700. THREE-DIMENSIONAL INTERLOCKED CORRUGATED CAPACITOR STRUCTURES (Intel Corporation)
- 18368771. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18372870. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18372871. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18374313. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18375311. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18376102. ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18383565. MULTILAYER CERAMIC CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18383567. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18384796. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18386090. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18387139. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18387659. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18390395. STANDALONE ISOLATION CAPACITOR simplified abstract (Texas Instruments Incorporated)
- 18390621. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18394032. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18400401. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18400411. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18400532. MULTILAYERED CAPACITOR simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18405482. ELECTRONIC COMPONENT simplified abstract (TDK Corporation)
- 18406839. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18409957. CAPACITOR, METHOD OF PREPARING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18411092. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18414789. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18415009. MULTILAYER CERAMIC CAPACITOR simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18422743. MULTILAYER CERAMIC ELECTRONIC COMPONENT (Samsung Electro-Mechanics Co., Ltd.)
- 18423647. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18429608. FILTER APPARATUS simplified abstract (Murata Manufacturing Co., Ltd.)
- 18429623. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18432669. MULTILAYER CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18434954. SEMICONDUCTOR DEVICES INCLUDING CAPACITOR AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18435335. MULTILAYER ELECTRONIC COMPONENT HAVING IMPROVED HIGH TEMPERATURE LOAD LIFE AND MOISTURE RESISTANCE RELIABILITY simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18436162. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18442627. MULTILAYER CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18444758. SEMICONDUCTOR STRUCTURE simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18487058. LAMINATED CERAMIC COMPONENT simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18493893. ELECTRONIC COMPONENT simplified abstract (TDK CORPORATION)
- 18498794. MULTILAYER ELECTRONIC DEVICE simplified abstract (TDK CORPORATION)
- 18502245. MULTILAYERED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18516725. MULTILAYERED CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18519368. MULTI-LAYERED CERAMIC CAPACITOR simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18523992. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18526361. MULTILAYER CAPACITOR AND SUBSTRATE INCLUDING THE SAME MOUNTED THEREON simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18526367. CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18526389. MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING MULTILAYER ELECTRONIC COMPONENT MOUNTED THEREON simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18527434. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18527439. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18527814. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18530295. FILTER DEVICE AND RADIO FREQUENCY FRONT END CIRCUIT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18530848. ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18530856. ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18535394. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME (Samsung Electro-Mechanics Co., Ltd.)
- 18537482. MULTILAYER CERAMIC CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18538661. MULTILAYERED CAPACITOR simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18538670. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18540134. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18540138. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18541776. MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18544505. MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18580481. CONDUCTIVE PASTE FOR ELECTRODE FORMATION simplified abstract (KYOCERA CORPORATION)
- 18583094. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18583228. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18584412. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18584652. MULTILAYER CERAMIC CAPACITOR AND METHOD OF PREPARING THE SAME (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18585603. MULTILAYER CERAMIC CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18588454. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING CAPACITOR PILLAR simplified abstract (Micron Technology, Inc.)
- 18592268. ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18593693. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18598294. ELECTRONIC COMPONENT AND MOUNTING METHOD AND MOUNTING STRUCTURE THEREOF simplified abstract (Murata Manufacturing Co., Ltd.)
- 18598301. CONDUCTIVE PASTE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18598306. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18603515. ELECTRONIC COMPONENT STRUCTURE simplified abstract (TDK CORPORATION)
- 18603529. METAL-INSULATOR-METAL CAPACITOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18608994. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18608996. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18608997. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18608999. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18609020. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18609022. CONDUCTIVE PASTE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18609537. ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT STRUCTURE simplified abstract (TDK CORPORATION)
- 18609964. CAPACITOR COMPONENT INCLUDING INDIUM AND TIN, AND METHOD OF MANUFACTURING THE CAPACITOR COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18610464. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18612190. ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18614935. INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18616240. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18618166. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18619245. MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18624446. MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18641986. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18646513. DIELECTRIC CERAMIC COMPOSITION AND CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18650228. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18650285. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18652121. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18661768. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18663748. MULTILAYERED CAPACITOR (Samsung Electro-Mechanics Co., Ltd.)
- 18665821. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18665829. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18667044. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18667267. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18667273. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18667780. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18670161. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18671284. MULTILAYER ELECTRONIC COMPONENT (Samsung Electro-Mechanics Co., Ltd.)
- 18672063. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18673499. METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18673694. MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18675193. MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR-MOUNTED STRUCTURE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18675491. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18676986. CAPACITOR AND ELECTRONIC DEVICE WITH THE CAPACITOR MOUNTED THEREON (Samsung Electronics Co., Ltd.)
- 18677976. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18678525. CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18733071. RELEASE FILM AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT USING THE SAME (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18733322. ELECTRONIC COMPONENT simplified abstract (TDK CORPORATION)
- 18735609. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18738584. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18739374. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18742308. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18746113. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18746210. MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18754226. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18754231. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18754232. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18754245. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18755754. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18755757. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18755758. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18757744. SEMICONDUCTOR DEVICE HAVING CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18757900. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18775472. ELECTRONIC COMPONENT (TDK CORPORATION)
- 18776769. MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18782485. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18789751. MUTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18795352. MUTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18804885. ELECTRONIC COMPONENT (TDK Corporation)
- 18805970. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18806192. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18809515. SEMICONDUCTOR DEVICE INCLUDING CAPACITOR STRUCTURE (Samsung Electronics Co., Ltd.)
- 18814857. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18814950. CERAMIC ELECTRONIC COMPONENT INCLUDING BONDING LAYER BETWEEN BODY AND SINTERED EXTERNAL ELECTRODE (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18817544. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18818715. MULTILAYER CERAMIC ELECTRONIC COMPONENT (Murata Manufacturing Co., Ltd.)
- 18937221. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18942910. THIN FILM LAMINATE STRUCTURE, INTEGRATED DEVICE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE THIN FILM LAMINATE STRUCTURE (SAMSUNG ELECTRONICS CO., LTD.)
- 18943050. THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18957218. STACKED VARISTOR (Panasonic Intellectual Property Management Co., Ltd.)
- 18957522. INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18966314. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18970345. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18971341. MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18972182. MULTILAYER CAPACITOR (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18976399. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18976534. MULTILAYER CERAMIC ELECTRONIC COMPONENT (Murata Manufacturing Co., Ltd.)
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- Intel corporation (20240222018). SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract
- Intel corporation (20240413194). THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS
- Intel corporation (20240421181). THREE-DIMENSIONAL INTERLOCKED CORRUGATED CAPACITOR STRUCTURES
- Intel corporation (20240429269). INTEGRATED CAPACITOR
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on December 19th, 2024
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