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Category:H01G4/30
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Pages in category "H01G4/30"
The following 54 pages are in this category, out of 54 total.
1
- 17589953. DIELECTRIC MATERIAL COMPRISING BISMUTH COMPOUND AND METHOD OF MAKING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17589955. DIELECTRIC MATERIAL COMPRISING LEAD COMPOUND AND METHOD OF MAKING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17750742. DIELECTRIC MATERIAL, DEVICE INCLUDING THE SAME, AND METHOD OF PREPARING THE DIELECTRIC MATERIAL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17858552. DIELECTRIC MATERIAL, DEVICE INCLUDING THE SAME, AND METHOD OF PREPARING THE DIELECTRIC MATERIAL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18114394. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18131022. DIELECTRIC SLURRY COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT USING SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18132195. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18198533. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18213005. ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18368771. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18374313. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18375311. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18383565. MULTILAYER CERAMIC CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18383567. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18386090. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18390395. STANDALONE ISOLATION CAPACITOR simplified abstract (Texas Instruments Incorporated)
- 18400401. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18400411. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18434954. SEMICONDUCTOR DEVICES INCLUDING CAPACITOR AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18435335. MULTILAYER ELECTRONIC COMPONENT HAVING IMPROVED HIGH TEMPERATURE LOAD LIFE AND MOISTURE RESISTANCE RELIABILITY simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18436162. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18498794. MULTILAYER ELECTRONIC DEVICE simplified abstract (TDK CORPORATION)
- 18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18519368. MULTI-LAYERED CERAMIC CAPACITOR simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18523992. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18526361. MULTILAYER CAPACITOR AND SUBSTRATE INCLUDING THE SAME MOUNTED THEREON simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18526367. CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18527434. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18527439. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18530295. FILTER DEVICE AND RADIO FREQUENCY FRONT END CIRCUIT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18537482. MULTILAYER CERAMIC CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
B
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- Murata manufacturing co., ltd. (20240186065). ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240186066). CHIP CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Murata manufacturing co., ltd. (20240186068). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata Manufacturing Co., Ltd. patent applications on January 18th, 2024
- Murata Manufacturing Co., Ltd. patent applications on June 6th, 2024
S
- Samsung electronics co., ltd. (20240105765). CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240186368). SEMICONDUCTOR DEVICES INCLUDING CAPACITOR AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
T
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- US Patent Application 17969189. MULTILAYER ELECTRONIC COMPONENT simplified abstract
- US Patent Application 18125868. MULTILAYER ELECTRONIC COMPONENT simplified abstract
- US Patent Application 18228050. DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR COMPRISING SAME simplified abstract
- US Patent Application 18232050. MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON simplified abstract
- US Patent Application 18233407. MULTILAYER CERAMIC CAPACITOR simplified abstract
- US Patent Application 18315563. DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract
- US Patent Application 18324344. MULTILAYER CERAMIC ELECTRONIC DEVICE simplified abstract