Category:Gang Duan of Chandler AZ (US)

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Gang Duan of Chandler AZ (US)

Executive Summary

Gang Duan of Chandler AZ (US) is an inventor who has filed 21 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (13 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), and they have worked with companies such as Intel Corporation (21 patents). Their most frequent collaborators include (12 collaborations), (10 collaborations), (10 collaborations).

Patent Filing Activity

Gang Duan of Chandler AZ (US) Monthly Patent Applications.png

Technology Areas

Gang Duan of Chandler AZ (US) Top Technology Areas.png

List of Technology Areas

  • H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 13 patents
  • H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
  • H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
  • H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 8 patents
  • H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 7 patents
  • H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
  • H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 5 patents
  • H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 5 patents
  • H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 5 patents
  • H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 4 patents
  • H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
  • H01L23/5383 ({Multilayer substrates (): 3 patents
  • H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
  • H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
  • H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
  • H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/1703 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L23/645 ({Inductive arrangements (): 2 patents
  • H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L23/295 ({containing a filler (): 2 patents
  • H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L23/24 (solid or gel at the normal operating temperature of the device {(): 1 patents
  • H01L23/3675 (Cooling facilitated by shape of device {(): 1 patents
  • H01L23/373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/24226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L28/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/49866 ({characterised by the materials (materials of the substrates): 1 patents
  • H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/585 ({comprising conductive layers or plates or strips or rods or rings (): 1 patents
  • H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
  • H01L2224/05611 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80411 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80447 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/642 ({Capacitive arrangements (): 1 patents
  • H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
  • H01L25/117 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
  • H01L29/66181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/32157 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/32165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1205 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/0345 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/03452 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/0347 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05073 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05558 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05573 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05644 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05664 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L27/156 (including semiconductor components having potential barriers, specially adapted for light emission): 1 patents
  • H01L23/4821 (consisting of lead-in layers inseparably applied to the semiconductor body {(electrodes): 1 patents
  • H01L2224/32146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/32235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1435 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/16238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
  • H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/14 ({of a plurality of bump connectors}): 1 patents
  • H01L2224/1403 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/16152 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/42 (Fillings or auxiliary members in containers {or encapsulations} selected or arranged to facilitate heating or cooling): 1 patents
  • H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
  • H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

  • Intel Corporation: 21 patents

Collaborators

Subcategories

This category has the following 5 subcategories, out of 5 total.

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Pages in category "Gang Duan of Chandler AZ (US)"

The following 199 pages are in this category, out of 199 total.

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