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Category:Gang Duan of Chandler AZ (US)
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Pages in category "Gang Duan of Chandler AZ (US)"
The following 70 pages are in this category, out of 70 total.
1
- 17847407. PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES simplified abstract (Intel Corporation)
- 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
- 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17943354. TECHNOLOGIES FOR GLASS CORE INDUCTOR simplified abstract (Intel Corporation)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)
- 17956757. PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract (Intel Corporation)
- 17957225. INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (Intel Corporation)
- 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957355. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957359. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation)
- 17958053. METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract (Intel Corporation)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18059074. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18059089. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18059923. PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE simplified abstract (Intel Corporation)
- 18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
- 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation)
- 18071116. RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract (Intel Corporation)
- 18071237. GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract (Intel Corporation)
- 18071901. OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT simplified abstract (Intel Corporation)
- 18080152. INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract (Intel Corporation)
- 18080612. LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE simplified abstract (Intel Corporation)
- 18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation)
I
- Intel corporation (20240105571). IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS simplified abstract
- Intel corporation (20240105625). OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS simplified abstract
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240111092). PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract
- Intel corporation (20240112970). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240112971). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240112973). METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract
- Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113047). INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract
- Intel corporation (20240113048). INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract
- Intel corporation (20240113072). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240114623). HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel corporation (20240162158). PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract
- Intel corporation (20240176084). PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE simplified abstract
- Intel corporation (20240176085). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240177918). GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract
- Intel corporation (20240178119). RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract
- Intel corporation (20240178146). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
- Intel corporation (20240178151). OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT simplified abstract
- Intel corporation (20240178207). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240186227). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240186250). Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein simplified abstract
- Intel corporation (20240186251). SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT simplified abstract
- Intel corporation (20240186263). STRUCTURE AND PROCESS FOR WARPAGE REDUCTION simplified abstract
- Intel corporation (20240186270). MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN simplified abstract
- Intel corporation (20240186279). IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVICE ATTACHMENT simplified abstract
- Intel corporation (20240186280). THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract
- Intel corporation (20240186281). METHOD FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract
- Intel corporation (20240188212). PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING simplified abstract
- Intel corporation (20240188223). MATERIAL DEPOSITION APPARATUS AND METHOD simplified abstract
- Intel corporation (20240194548). APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract
- Intel corporation (20240194608). LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE simplified abstract
- Intel corporation (20240194657). INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract