Category:Francis J. CARNEY of Mesa AZ (US)

Francis J. CARNEY of Mesa AZ (US)

Executive Summary

Francis J. CARNEY of Mesa AZ (US) is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02013 ({Grinding, lapping}): 1 patents
• H01L21/02016 ({Backside treatment}): 1 patents
• H01L2021/60015 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• B22F7/064 (of composite workpieces or articles from parts, e.g. to form tipped tools {(): 1 patents
• H01L21/4882 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• B22F2301/10 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/302 (Treatment of semiconductor bodies using processes or apparatus not provided for in groups): 1 patents
• H01L21/48 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L23/12 (Mountings, e.g. non-detachable insulating substrates): 1 patents
• H01L23/3185 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/04 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/26 ({Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto}): 1 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
• H01L23/145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/32 (Holders for supporting the complete device in operation, i.e. detachable fixtures (): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 1 patents
• B21D11/10 (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire): 1 patents
• H01L21/02035 ({Shaping}): 1 patents

Companies

List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 5 patents

Collaborators

• Michael J. SEDDON of Gilbert AZ (US) (3 collaborations)
• Chee Hiong CHEW (2 collaborations)
• Yusheng LIN of Phoenix AZ (US) (1 collaborations)
• Shunsuke YASUDA (1 collaborations)
• Erik Nino Mercado TOLENTINO (1 collaborations)
• Shutesh KRISHNAN (1 collaborations)
• Soon Wei WANG (1 collaborations)
• Eiji KUROSE (1 collaborations)