Category:Eric Beyne

Eric Beyne

Executive Summary

Eric Beyne is an inventor who has filed 4 patents. Their primary areas of innovation include Modifications to facilitate cooling, ventilating, or heating (1 patents), Modifications to facilitate cooling, ventilating, or heating (1 patents), the devices being of types provided for in two or more different main groups of groups (1 patents), and they have worked with companies such as IMEC VZW (3 patents), IMEC vzw (1 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H05K7/20327 (Modifications to facilitate cooling, ventilating, or heating): 1 patents
• H05K7/20318 (Modifications to facilitate cooling, ventilating, or heating): 1 patents
• H01L25/162 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
• H01L23/46 (involving the transfer of heat by flowing fluids (): 1 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5222 ({Capacitive arrangements or effects of, or between wiring layers (other capacitive arrangements): 1 patents
• H01L28/87 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L28/91 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• IMEC VZW: 3 patents
• IMEC vzw: 1 patents

Collaborators

• Herman Oprins (2 collaborations)
• Vladimir Cherman (1 collaborations)
• Jaber Derakhshandeh (1 collaborations)
• Geert Van der Plas (1 collaborations)
• Pieter Woeltgens (1 collaborations)
• Philip Nolmans (1 collaborations)
• Kenichi Miyaguchi (1 collaborations)