Category:Dimitrios Antartis of Hillsboro OR US

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Dimitrios Antartis

Dimitrios Antartis from Hillsboro OR US has applied for patents in technology areas such as H01L23/00, H01L23/31, H01L23/544 with intel corporation.

Patents

PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING (20250006678)

Pages in category "Dimitrios Antartis of Hillsboro OR US"

The following 3 pages are in this category, out of 3 total.

1

18473046. INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME (Intel Corporation)

I

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