Category:Dai-Ying LEE

Dai-Ying LEE

Executive Summary

Dai-Ying LEE is an inventor who has filed 5 patents. Their primary areas of innovation include {Via connections through the substrates, e.g. pins going through the substrate, coaxial cables ( (1 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (1 patents), {characterised by the materials (materials of the substrates (1 patents), and they have worked with companies such as MACRONIX INTERNATIONAL CO., LTD. (5 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/49866 ({characterised by the materials (materials of the substrates): 1 patents
• H01L23/49877 ({Carbon, e.g. fullerenes (superconducting fullerenes): 1 patents
• G11C16/102 (Programming or data input circuits): 1 patents
• G11C16/26 (Sensing or reading circuits; Data output circuits): 1 patents
• G11C16/3459 ({Circuits or methods to verify correct programming of nonvolatile memory cells}): 1 patents
• G11C29/40 (STATIC STORES (semiconductor memory devices): 1 patents
• G11C2029/4002 (STATIC STORES (semiconductor memory devices): 1 patents
• H01L21/76843 ({formed in openings in a dielectric}): 1 patents
• H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/53266 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B63/845 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B61/22 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B63/34 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10N50/01 (No explanation available): 1 patents
• H10N70/066 (No explanation available): 1 patents
• G11C7/1063 (Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers): 1 patents
• G11C7/109 (Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers): 1 patents
• G11C7/1006 ({Data managing, e.g. manipulating data before writing or reading out, data bus switches or control circuits therefor}): 1 patents

Companies

List of Companies

• MACRONIX INTERNATIONAL CO., LTD.: 5 patents

Collaborators

• Ming-Hsiu LEE (3 collaborations)
• Cheng-Hsien LU (2 collaborations)
• Yun-Yuan WANG (2 collaborations)
• Yu-Hsuan LIN (2 collaborations)
• Feng-Min LEE (2 collaborations)
• Yu-Chao HUANG (1 collaborations)
• Erh-Kun LAI (1 collaborations)
• Po-Hao TSENG (1 collaborations)