Category:CHIEN-CHEN LEE

CHIEN-CHEN LEE

Executive Summary

CHIEN-CHEN LEE is an inventor who has filed 9 patents. Their primary areas of innovation include {Containers} (8 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (9 patents). Their most frequent collaborators include (9 collaborations), (6 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L27/14618 ({Containers}): 8 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L27/14636 ({Interconnect structures}): 4 patents
• H01L21/52 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/92 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/92247 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/50 (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 2 patents
• H01L27/14623 ({Optical shielding}): 2 patents
• H01L27/14683 ({Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof (not peculiar thereto): 2 patents
• H01L24/85 ({using a wire connector (wire bonding in general): 2 patents
• H01L2224/85801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 1 patents
• H01L2223/54486 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/95148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2223/54426 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• TONG HSING ELECTRONIC INDUSTRIES, LTD.: 9 patents

Collaborators

• LI-CHUN HUNG (9 collaborations)
• JUI-HUNG HSU (6 collaborations)
• DONG-RU WU (2 collaborations)
• YOU-WEI CHANG (1 collaborations)