Category:Brian Rice of Dayton OH (US)

Brian Rice of Dayton OH (US)

Executive Summary

Brian Rice of Dayton OH (US) is an inventor who has filed 1 patents. Their primary areas of innovation include PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR (1 patents), WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire (1 patents), NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS (1 patents), and they have worked with companies such as University of Dayton Research Institute (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• C25D13/02 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 1 patents
• B21D39/02 (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire): 1 patents
• C01B32/16 (NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS): 1 patents
• C01B32/168 (After-treatment): 1 patents
• C25D3/38 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 1 patents
• C25D5/54 (Electroplating of non-metallic surfaces (): 1 patents
• C25D7/0607 ({Wires}): 1 patents
• C25D13/16 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 1 patents
• B82Y30/00 (Nanotechnology for materials or surface science, e.g. nanocomposites): 1 patents
• B82Y40/00 (Manufacture or treatment of nanostructures): 1 patents
• C01B2202/08 (NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS): 1 patents
• C01P2004/03 (obtained by SEM): 1 patents

Companies

List of Companies

• University of Dayton Research Institute: 1 patents

Collaborators

• Paul Kladitis of Clayton OH (US) (1 collaborations)
• Lingchuan Li of Mason OH (US) (1 collaborations)