Category:Bin Yan

Bin Yan

Executive Summary

Bin Yan is an inventor who has filed 6 patents. Their primary areas of innovation include PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (2 patents), Pivotal connections (hinges for doors, windows or wings (2 patents), {Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position (combined with translation movement (1 patents), and they have worked with companies such as Honor Device Co., Ltd. (6 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H05K5/0226 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• F16C11/04 (Pivotal connections (hinges for doors, windows or wings): 2 patents
• H04M1/0214 ({Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position (combined with translation movement): 1 patents
• H04M1/0243 ({using the relative angle between housings}): 1 patents
• H04M1/0245 ({using open/close detection}): 1 patents
• H04M1/0264 ({for a camera module assembly}): 1 patents
• H04M1/0266 ({for a display module assembly}): 1 patents
• H04M1/0283 ({for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate}): 1 patents
• H04M1/026 ({Details of the structure or mounting of specific components}): 1 patents
• H05K5/03 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• G09G3/035 (ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays): 1 patents
• G06F1/1681 ({Details related solely to hinges (hinge details related to the transmission of signals or power are classified in): 1 patents
• E05D3/02 (HINGES OR SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS (pivotal connections in general): 1 patents
• H04W4/029 (WIRELESS COMMUNICATION NETWORKS (broadcast communication): 1 patents
• H04W4/80 (WIRELESS COMMUNICATION NETWORKS (broadcast communication): 1 patents

Companies

List of Companies

• Honor Device Co., Ltd.: 6 patents

Collaborators

• Guotong Zhou (2 collaborations)
• Kangle Xue (1 collaborations)
• Yaolei Zhang (1 collaborations)
• Yihe Zhang (1 collaborations)
• Yan Lv (1 collaborations)
• Dong Ma (1 collaborations)
• Nengfu Tang (1 collaborations)
• Weilin Gong (1 collaborations)
• Yashu Zhang (1 collaborations)