Category:Anshul Gupta

Anshul Gupta

Executive Summary

Anshul Gupta is an inventor who has filed 3 patents. Their primary areas of innovation include {Making of internal connections, substrate contacts} (1 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (1 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (1 patents), and they have worked with companies such as IMEC VZW (3 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/743 ({Making of internal connections, substrate contacts}): 1 patents
• H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L27/0924 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76224 ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 1 patents
• H01L21/76805 ({the opening being a via or contact hole penetrating the underlying conductor}): 1 patents
• H01L23/50 (for integrated circuit devices, {e.g. power bus, number of leads} (): 1 patents
• H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 1 patents
• H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/7685 ({the layer covering a conductive structure (): 1 patents
• H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents

Companies

List of Companies

• IMEC VZW: 3 patents

Collaborators

• Boon Teik Chan (1 collaborations)
• Zheng Tao (1 collaborations)
• Efrain Altamirano Sanchez (1 collaborations)
• Basoene Briggs (1 collaborations)
• Hans Mertens (1 collaborations)
• Zsolt Tokei (1 collaborations)
• Stefan Decoster (1 collaborations)