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Category:Aaron Gorius of Upton MA (US)

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Aaron Gorius

Aaron Gorius from Upton MA (US) has applied for patents in technology areas such as H01L25/065, H01L23/00, H01L23/522 with intel corporation.

Patents

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH SOLDER INTERCONNECTS (20250062278)

Subcategories

This category has the following 4 subcategories, out of 4 total.

A

► Abhishek A. Sharma of Portland OR (US)‎ (4 C, 13 P)

D

► Debendra Mallik of Chandler AZ (US)‎ (5 C, 38 P)

N

► Nitin A. Deshpande of Chandler AZ (US)‎ (5 C, 21 P)

W

► Wilfred Gomes of Portland OR (US)‎ (4 C, 83 P)

Pages in category "Aaron Gorius of Upton MA (US)"

The following 2 pages are in this category, out of 2 total.

1

17846086. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)

I

Intel corporation (20250062278). PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH SOLDER INTERCONNECTS

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