Canon kabushiki kaisha (20240347565). ELECTRONIC COMPONENT AND EQUIPMENT simplified abstract
Contents
ELECTRONIC COMPONENT AND EQUIPMENT
Organization Name
Inventor(s)
SUSUMU Matsumoto of Kanagawa (JP)
SATORU Hamasaki of Kanagawa (JP)
TAIKI Shitamichi of Kanagawa (JP)
ELECTRONIC COMPONENT AND EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347565 titled 'ELECTRONIC COMPONENT AND EQUIPMENT
Simplified Explanation: The patent application describes an electronic component with a base body, an electronic device on a placement surface, and a lid fixed to the base body. The lid has a thin film on its surface that applies force towards the outer edge.
Key Features and Innovation:
- Electronic component with base body, electronic device, and lid
- Thin film on lid surface applying force towards outer edge
Potential Applications: This technology could be used in various electronic devices where precise force application is required for optimal performance.
Problems Solved: This technology addresses the need for controlled force application in electronic components to ensure proper functioning.
Benefits:
- Enhanced performance of electronic devices
- Improved durability and reliability
- Precise force application for better functionality
Commercial Applications: Potential commercial applications include consumer electronics, medical devices, and industrial equipment where precise force application is crucial for operation.
Prior Art: Readers can start searching for prior art related to this technology in the field of electronic components, force application mechanisms, and thin film technology.
Frequently Updated Research: Stay updated on research related to force application in electronic components, thin film technology advancements, and applications of precise force in various industries.
Questions about the Technology: 1. How does the thin film on the lid surface enhance the performance of the electronic device? 2. What are the potential challenges in implementing this technology in different types of electronic components?
Original Abstract Submitted
an electronic component that includes a base body with an electronic device placed on a placement surface, and a lid including a surface facing the electronic device and fixed to the base body, is provided. on the surface of the lid, a thin film in contact with the surface is arranged. in an orthogonal projection with respect to the placement surface, the thin film comprises a first portion including a region which overlaps the electronic device, and a second portion arranged so as to surround the first portion and including an outer edge of the thin film, and the second portion applies, to a portion of the lid in contact with the second portion, a force in a direction from a center of the thin film toward the outer edge.
