Canon kabushiki kaisha (20240336065). FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE simplified abstract
FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE
Organization Name
Inventor(s)
TAKAMITSU Tokuda of Kanagawa (JP)
FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240336065 titled 'FLEXIBLE ELECTRIC WIRING SUBSTRATE AND CHIP UNIT AND METHOD OF INSPECTING FLEXIBLE ELECTRIC WIRING SUBSTRATE
The abstract describes a flexible electric wiring substrate with multiple groups, each containing wiring, a connector land, a pad, and a plating lead for current supply during electrolytic plating.
- The substrate includes wiring, connector lands, pads, and plating leads for current supply during electrolytic plating.
- Multiple plating leads are arranged for inspection probes to be abutted onto each lead.
- The substrate offers flexibility and connectivity for electronic components.
- The design allows for efficient and accurate inspection processes.
- The plating leads serve as current supply ports for electrolytic plating of the pads.
Potential Applications: - Electronics manufacturing - Automotive industry - Aerospace technology
Problems Solved: - Enhanced connectivity in electric wiring substrates - Improved efficiency in inspection processes
Benefits: - Increased flexibility in wiring applications - Streamlined inspection procedures - Reliable current supply for plating operations
Commercial Applications: Title: "Innovative Flexible Electric Wiring Substrate for Enhanced Connectivity" This technology can be utilized in various industries such as electronics manufacturing, automotive, and aerospace for improved wiring solutions and efficient inspection processes.
Questions about the technology: 1. How does the design of the substrate improve inspection processes? - The design allows for easy access and connection of inspection probes to the plating leads, ensuring accurate and efficient inspections. 2. What are the key benefits of using plating leads for current supply during electrolytic plating? - Plating leads provide a reliable source of current for the plating process, ensuring consistent and high-quality results.
Original Abstract Submitted
provided is a flexible electric wiring substrate including multiple groups each including wiring, a connector land that electrically connects a terminal of a connector to the wiring, a pad that connects a terminal of an electronic part to the wiring, and a plating lead that is electrically connected with the pad through the wiring and is used as a current supply port at least in a case of electrolytic plating of the pad, in which the multiple plating leads are arranged such that each of multiple inspection probes arrayed on a probe holding substrate is abutted onto each plating lead.
