Canon kabushiki kaisha (20240291926). CIRCUIT BOARD AND IMAGE FORMING APPARATUS simplified abstract
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CIRCUIT BOARD AND IMAGE FORMING APPARATUS
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CIRCUIT BOARD AND IMAGE FORMING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240291926 titled 'CIRCUIT BOARD AND IMAGE FORMING APPARATUS
The abstract describes a circuit board with two surfaces, each with a region for mounting different electronic parts. The board includes a via for heat dissipation shared between the two regions.
- Circuit board with two surfaces for mounting different electronic parts
- Via for shared heat dissipation between regions
- Opposing positions of the first and second regions across the board
Potential Applications: - Electronics manufacturing - Heat dissipation in electronic devices
Problems Solved: - Efficient heat dissipation in compact electronic devices - Space optimization on circuit boards
Benefits: - Improved performance of electronic components - Enhanced reliability of electronic devices
Commercial Applications: Title: "Innovative Circuit Board Technology for Enhanced Heat Dissipation" This technology can be used in various electronic devices such as smartphones, laptops, and IoT devices to improve heat management and overall performance.
Questions about Circuit Board Technology: 1. How does the via for heat dissipation improve the performance of electronic components?
The via allows for efficient sharing of heat dissipation between different electronic parts, preventing overheating and enhancing overall performance.
2. What are the potential challenges in implementing this circuit board technology in mass-produced electronic devices?
The main challenge could be the integration of the via for heat dissipation without compromising the overall design and functionality of the electronic device.
Original Abstract Submitted
a circuit board includes a first surface including a first region in which a first electronic part is mountable, and a second surface including a second region in which a second electronic part different from the first electronic part is mountable. the first region of the first surface and the second region of the second surface are provided at positions opposed to each other across the circuit board, and wherein the circuit board has a via for heat dissipation to be shared for heat dissipation of the first electronic part and the second electronic part formed therein to connect the first region and the second region to each other.
