Canon kabushiki kaisha (20240266281). SEMICONDUCTOR APPARATUS AND EQUIPMENT simplified abstract
Contents
SEMICONDUCTOR APPARATUS AND EQUIPMENT
Organization Name
Inventor(s)
SEMICONDUCTOR APPARATUS AND EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266281 titled 'SEMICONDUCTOR APPARATUS AND EQUIPMENT
Simplified Explanation: The semiconductor apparatus described in the patent application includes multiple substrates connected by an insulating member, with a conductive layer and through via passing through the substrates.
Key Features and Innovation:
- Semiconductor apparatus with multiple substrates connected by an insulating member
- Conductive layer with through via passing through the substrates
- Resin layers with different Young's modulus for improved performance
Potential Applications: This technology can be used in various semiconductor devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved: This technology addresses the need for improved connectivity and performance in semiconductor devices.
Benefits:
- Enhanced connectivity between substrates
- Improved performance and reliability of semiconductor devices
- Potential for miniaturization and increased functionality
Commercial Applications: The technology can be applied in the manufacturing of advanced electronic devices, leading to improved performance and reliability in various industries such as telecommunications, automotive, and consumer electronics.
Prior Art: Prior research in the field of semiconductor devices and packaging techniques may provide insights into similar technologies and advancements.
Frequently Updated Research: Ongoing research in semiconductor materials, packaging technologies, and device integration could provide further advancements and applications for this technology.
Questions about Semiconductor Apparatus: 1. What are the potential limitations of using resin layers with different Young's modulus in semiconductor devices? 2. How does the through via structure improve the connectivity and performance of the semiconductor apparatus?
Original Abstract Submitted
a semiconductor apparatus comprising a first substrate, a second substrate coupled with the first substrate via an insulating member, a third substrate coupled to the first substrate and disposed on the opposite side to the second substrate and a conductive layer including an electrode disposed between the first and second substrate is provided. a through via is disposed so as to pass through the second substrate and a part of the insulating member to reach the electrode. an opening is arranged overlapping the electrode in the first substrate and a part of the insulating member. first and second resin layers are disposed between the electrode and the third substrate, and the first resin layer is disposed within the opening, is disposed between the electrode and the second resin layer and has a different young's modulus from the second resin layer.
