Canon kabushiki kaisha (20240253354). SUBSTRATE JOINED BODY simplified abstract
Contents
SUBSTRATE JOINED BODY
Organization Name
Inventor(s)
Taichi Yonemoto of Kanagawa (JP)
Yoshiyuki Fukumoto of Kanagawa (JP)
Atsunori Terasaki of Kanagawa (JP)
SUBSTRATE JOINED BODY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240253354 titled 'SUBSTRATE JOINED BODY
The patent application describes a substrate joined body consisting of a first substrate, a second substrate, an organic film containing silicon and carbon that joins the substrates, and a protective film made of an inorganic element formed over the organic film on the surfaces of the substrates.
- The protective film contains a region with a specific ratio of carbon to silicon within 50 nm from the surface of the organic film.
- The protective film is analyzed using x-ray photoelectron spectroscopy to determine the carbon to silicon ratio.
- The protective film acts as a barrier to protect the organic film and the substrates from external factors.
- The combination of the organic film and protective film enhances the durability and stability of the substrate joined body.
- This technology can be applied in various industries such as electronics, semiconductors, and optoelectronics.
Potential Applications: - Electronic devices - Semiconductor manufacturing - Optoelectronic devices
Problems Solved: - Protection of organic films in substrate joined bodies - Enhanced durability and stability of substrates - Prevention of degradation due to external factors
Benefits: - Improved longevity of substrate joined bodies - Enhanced performance of electronic and optoelectronic devices - Increased reliability in semiconductor manufacturing processes
Commercial Applications: Title: Advanced Protective Coating Technology for Substrate Joined Bodies This technology can be utilized in the production of electronic devices, semiconductor components, and optoelectronic systems to enhance their durability and performance. The market implications include improved product quality, increased reliability, and extended lifespan of the devices.
Questions about the technology: 1. How does the protective film contribute to the longevity of substrate joined bodies? 2. What are the specific advantages of using an organic film containing silicon and carbon in this technology?
Original Abstract Submitted
a substrate joined body including: a first substrate; a second substrate; an organic film that comprises silicon and carbon and joins the first substrate and the second substrate; and a protective film that comprises an inorganic element and is formed over the organic film from at least a part of the surface of the first substrate and at least a part of the surface of the second substrate, wherein the protective film comprises a region in which the ratio of carbon to silicon based on atomic percentage is from 0.0 to 5.0 in a region within 50 nm in a thickness direction from a surface of the organic film on the protective film side, when the surface is measured by x-ray photoelectron spectroscopy.
