Canon kabushiki kaisha (20240248393). IMPRINT METHOD, IMPRINT APPARATUS, DETERMINING METHOD, INFORMATION PROCESSING APPARATUS AND ARTICLE MANUFACTURING METHOD simplified abstract
IMPRINT METHOD, IMPRINT APPARATUS, DETERMINING METHOD, INFORMATION PROCESSING APPARATUS AND ARTICLE MANUFACTURING METHOD
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IMPRINT METHOD, IMPRINT APPARATUS, DETERMINING METHOD, INFORMATION PROCESSING APPARATUS AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240248393 titled 'IMPRINT METHOD, IMPRINT APPARATUS, DETERMINING METHOD, INFORMATION PROCESSING APPARATUS AND ARTICLE MANUFACTURING METHOD
The abstract describes a method for performing an imprint process using a mold to form a pattern of an imprint material on a substrate. Before the imprint process, variables such as pressure values applied to the mold and substrate, as well as the relative tilt amount between the mold and substrate, are determined using a function. The method involves adjusting the pressure values and relative tilt amount to ensure that the contact position between the mold and the imprint material on the substrate matches a target position.
- The method involves determining pressure values and relative tilt amount before performing the imprint process.
- Pressure values applied to the mold and substrate are adjusted by a deformation unit.
- The relative tilt amount between the mold and substrate is adjusted by an adjustment unit.
- The goal is to ensure that the contact position between the mold and the imprint material matches a target position.
- This method aims to improve the accuracy and efficiency of the imprint process.
Potential Applications: - Semiconductor manufacturing - Nanotechnology - Microelectronics
Problems Solved: - Ensuring precise alignment during the imprint process - Improving the quality of patterns formed on substrates
Benefits: - Increased accuracy in pattern formation - Enhanced efficiency in the imprint process - Potential for cost savings in manufacturing processes
Commercial Applications: Title: Advanced Imprint Method for Precision Patterning in Semiconductor Manufacturing This technology could be used in the semiconductor industry to improve the quality and efficiency of pattern formation on substrates, leading to more precise and cost-effective manufacturing processes.
Questions about the technology: 1. How does this method compare to traditional imprint processes in terms of accuracy and efficiency? 2. What are the potential cost savings associated with implementing this advanced imprint method in semiconductor manufacturing?
Original Abstract Submitted
an imprint method of performing an imprint process of forming a pattern of an imprint material on a substrate by using a mold, the method including determining, before performing the imprint process, by using a function including, as variables, a pressure value applied to the mold, a pressure value applied to the substrate, and a relative tilt amount between the mold and the substrate, and expressing a contact position between the mold and the imprint material on the substrate, pressure values to be applied to the mold and the substrate, respectively, by a deformation unit and a relative tilt amount between the mold and the substrate to be adjusted by an adjustment unit such that a contact position to start a contact between the mold and the imprint material on the substrate matches a target position.
