Canon kabushiki kaisha (20240242994). CONVEYANCE APPARATUS, CONVEYANCE METHOD, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD simplified abstract
Contents
CONVEYANCE APPARATUS, CONVEYANCE METHOD, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD
Organization Name
Inventor(s)
OSAMU Yasunobe of Tochigi (JP)
CONVEYANCE APPARATUS, CONVEYANCE METHOD, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240242994 titled 'CONVEYANCE APPARATUS, CONVEYANCE METHOD, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD
Simplified Explanation: The patent application describes a conveyance apparatus for moving a substrate, consisting of a base, a holding unit, a cover plate, and a driver. The apparatus is designed to drive the holding unit between spaces on either side of a substrate chuck without interfering with the chuck.
Key Features and Innovation:
- Conveyance apparatus for moving substrates efficiently and without interference.
- Movable base and holding unit for secure substrate handling.
- Cover plate for protection and driver for driving the apparatus.
- Precise movement between spaces on either side of a substrate chuck.
Potential Applications: The technology can be used in semiconductor manufacturing, electronics assembly, and other industries requiring precise substrate handling.
Problems Solved: The technology addresses the challenge of moving substrates without interference from chuck surfaces, ensuring smooth and efficient operations.
Benefits:
- Improved substrate handling efficiency.
- Enhanced precision in substrate movement.
- Reduced risk of damage to substrates during conveyance.
Commercial Applications: The conveyance apparatus can be utilized in semiconductor fabrication facilities, electronics manufacturing plants, and other industries requiring precise substrate handling for commercial production.
Prior Art: Readers interested in prior art related to this technology can explore patents and research papers in the field of substrate handling, semiconductor manufacturing, and automation technologies.
Frequently Updated Research: Stay updated on the latest advancements in substrate handling technologies, automation systems, and semiconductor manufacturing processes to enhance the efficiency and effectiveness of substrate conveyance.
Questions about Substrate Conveyance Technology: 1. What are the key advantages of using this conveyance apparatus in semiconductor manufacturing? 2. How does the technology ensure precise movement of substrates without interference from chuck surfaces?
Original Abstract Submitted
a conveyance apparatus for conveying a substrate is provided. the apparatus includes a movable base, a holding unit attached to the base and configured to hold the substrate and be movable with respect to the base, a cover plate attached to the base, and a driver configured to drive the base and the holding unit. the driver is configured to, in a state in which the cover plate covers a surface of the substrate held by a substrate chuck, drive the holding unit between a first space on a side of a substrate chuck where interference with the substrate chuck does not occur and a second space between a chuck surface of the substrate chuck and the substrate raised from the chuck surface.
