Canon kabushiki kaisha (20240231220). PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE simplified abstract
Contents
PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE
Organization Name
Inventor(s)
Seth J. Bamesberger of Austin TX (US)
Byung-Jin Choi of Austin TX (US)
Steven C. Shackleton of Austin TX (US)
Masaki Saito of Austin TX (US)
PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240231220 titled 'PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE
The abstract describes a planarization system that includes a superstrate chuck with an inflatable membrane and a purge gas channel.
- The superstrate chuck has a holding surface for the superstrate.
- The inflatable membrane has an inner and outer diameter, with a midpoint between them.
- The inflatable membrane is positioned radially outward of the holding surface of the superstrate chuck.
- A purge gas channel is located radially inward of the midpoint of the inflatable membrane and radially outward of the holding surface of the superstrate chuck.
Potential Applications: - Semiconductor manufacturing processes - Flat panel display production - Optical component fabrication
Problems Solved: - Ensures uniform planarization of superstrates - Improves surface quality and accuracy in manufacturing processes
Benefits: - Enhanced precision in planarization - Increased efficiency in production processes - Improved overall product quality
Commercial Applications: Title: Advanced Planarization System for Semiconductor Manufacturing This technology can be utilized in the semiconductor industry to improve the quality and efficiency of manufacturing processes, leading to higher yields and better product performance.
Questions about the technology: 1. How does the inflatable membrane contribute to the planarization process?
The inflatable membrane helps to apply uniform pressure across the superstrate for consistent planarization.
2. What advantages does the purge gas channel offer in this system?
The purge gas channel helps to remove any debris or contaminants during the planarization process.
Original Abstract Submitted
a planarization system, comprising a superstrate chuck including a holding surface configured to hold a superstrate, an inflatable membrane having an inner diameter defining an inner edge, an outer diameter defining an outer edge, and, a midpoint between the inner edge and the outer edge in a radial direction, wherein the inflatable membrane is disposed radially outward of the holding surface of the superstrate chuck, and a purge gas channel disposed radially inward of the midpoint of the inflatable membrane and radially outward of the holding surface of the superstrate chuck.
