Canon kabushiki kaisha (20240219827). GENERATING WHOLE SUBSTRATE DROP PATTERNS WITH REPEATING EVALUATION REGIONS simplified abstract
Contents
GENERATING WHOLE SUBSTRATE DROP PATTERNS WITH REPEATING EVALUATION REGIONS
Organization Name
Inventor(s)
Craig William Cone of Austin TX (US)
Ahmed M. Hussein of Austin TX (US)
James W. Irving of Austin TX (US)
Ecron D. Thompson of Round Rock TX (US)
GENERATING WHOLE SUBSTRATE DROP PATTERNS WITH REPEATING EVALUATION REGIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240219827 titled 'GENERATING WHOLE SUBSTRATE DROP PATTERNS WITH REPEATING EVALUATION REGIONS
The patent application describes a method for generating whole substrate drop patterns on a test substrate, each consisting of repeating drop patterns in evaluation regions corresponding to a film to be formed.
- Whole substrate drop patterns are created on a test substrate with predetermined dimensions.
- Repeating drop patterns are present in evaluation regions of the test substrate.
- Statistical parameters of distributions of physical attributes related to the film thickness are calculated.
- Figures of merit are determined from the statistical parameters for each whole substrate drop pattern.
- A satisfactory drop pattern with a satisfactory figure of merit is selected from the whole substrate drop patterns.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Quality control in microelectronics industry
Problems Solved: - Ensuring uniformity in film thickness - Improving production efficiency - Enhancing product quality and performance
Benefits: - Increased accuracy in film deposition - Cost savings through optimized processes - Consistent product quality
Commercial Applications: Title: "Advanced Thin Film Deposition Technology for Semiconductor Manufacturing" This technology can be utilized in the semiconductor industry to improve thin film deposition processes, leading to higher quality products and increased efficiency in production.
Questions about the technology: 1. How does this method compare to traditional thin film deposition techniques?
This method offers improved control and uniformity in film thickness, enhancing overall product quality.
2. What are the potential cost savings associated with implementing this technology?
By optimizing processes and reducing material waste, significant cost savings can be achieved.
Original Abstract Submitted
n whole substrate drop patterns are generated. each of the n whole substrate drop pattern has m repeating drop patterns in repeating evaluation regions of a test substrate with predetermined dimensions and corresponding to a film to be formed from each of the n whole substrate drop patterns on test substrate. p statistical parameters of q distributions of physical attributes of the m repeating drop patterns are calculated. the q physical attributes are related to a thickness of a top layer of the film above substrate features. n figures of merit from the p statistical parameters corresponding to the n whole substrate drop patterns are determined. from the n whole substrate drop patterns, a satisfactory drop pattern that has a satisfactory figure of merit is selected among the n figures of merit. n, m, p, and q are positive integers.
