Canon kabushiki kaisha (20240213285). SEMICONDUCTOR DEVICE AND APPARATUS simplified abstract
Contents
SEMICONDUCTOR DEVICE AND APPARATUS
Organization Name
Inventor(s)
TOMOTAKE Morita of Kanagawa (JP)
SEMICONDUCTOR DEVICE AND APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213285 titled 'SEMICONDUCTOR DEVICE AND APPARATUS
The abstract describes a semiconductor device with a semiconductor layer, a wiring structure, and a pad exposed through an opening in the semiconductor layer. The pad is located between the semiconductor layer and a wiring layer, with an insulating portion embedded in the semiconductor layer surrounding the pad.
- The semiconductor device includes a semiconductor layer with first and second surfaces, a wiring structure on the second surface, and a pad exposed through an opening in the first surface.
- The pad is positioned between the first surface and a wiring layer closest to the second surface, partially exposed by the opening.
- An insulating portion in the semiconductor layer surrounds the pad, with its outer edge enclosing the outer edge of the pad.
- The wall surface of the opening is formed by the semiconductor layer and the insulating portion.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices for various electronic applications. - It can improve the performance and reliability of integrated circuits and microprocessors.
Problems Solved: - Enhances the integration and functionality of semiconductor devices. - Provides better insulation and protection for sensitive components.
Benefits: - Increased efficiency and performance of electronic devices. - Enhanced durability and reliability of semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and automotive electronics, leading to improved functionality and reliability in the market.
Prior Art: Researchers can explore prior patents related to semiconductor device structures and insulating techniques to understand the evolution of this technology.
Frequently Updated Research: Researchers are constantly developing new methods to enhance semiconductor device performance and reliability, so staying updated on the latest advancements is crucial for industry professionals.
Questions about Semiconductor Device Technology: 1. How does the insulating portion in the semiconductor layer contribute to the overall functionality of the device? The insulating portion provides protection and insulation for the pad and surrounding components, ensuring reliable performance.
2. What are the potential challenges in implementing this advanced semiconductor device technology in mass production? Mass production challenges may include optimizing manufacturing processes and ensuring consistent quality control measures.
Original Abstract Submitted
a semiconductor device is provided. the device includes a semiconductor layer which forms a part of first and second surfaces respectively, a wiring structure arranged on the second surface, and a pad. an opening portion for exposing the pad is provided in the first surface. the pad is arranged between the first surface and a wiring layer closest to the second surface among wiring layers arranged in the wiring structure, and has a third surface which partially exposed by the opening portion. an insulating portion forming a part of the second surface is embedded in the semiconductor layer. an outer edge of the insulating portion is arranged so as to surround an outer edge of the pad. a wall surface of the opening portion is formed by the semiconductor layer and the insulating portion, or formed by the insulating portion.
