Canon kabushiki kaisha (20240210820). IMPRINT APPARATUS, IMPRINT METHOD AND ARTICLE MANUFACTURING METHOD simplified abstract
Contents
IMPRINT APPARATUS, IMPRINT METHOD AND ARTICLE MANUFACTURING METHOD
Organization Name
Inventor(s)
Keisuke Kimura of Tochigi (JP)
IMPRINT APPARATUS, IMPRINT METHOD AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240210820 titled 'IMPRINT APPARATUS, IMPRINT METHOD AND ARTICLE MANUFACTURING METHOD
The abstract describes an imprint apparatus that includes a mold holding unit, an adjusting unit, and a control unit. The apparatus is used in an imprint process to separate a mold from a pattern made of a cured product of an imprint material on a substrate.
- Mold holding unit holds the mold
- Adjusting unit adjusts pressure difference between surfaces
- Control unit controls the imprint process
- Separation process separates the mold from the pattern on the substrate
- Pressure difference is adjusted so that the first pressure is smaller than the second pressure
Potential Applications: - Semiconductor manufacturing - Nanotechnology - Optics and photonics
Problems Solved: - Precise separation of mold from substrate - Control of pressure difference during imprint process
Benefits: - Improved accuracy in pattern transfer - Enhanced efficiency in manufacturing processes - Consistent results in imprinting technology
Commercial Applications: Imprint apparatus for semiconductor industry: Enhancing precision in pattern transfer processes
Prior Art: Researchers can explore prior patents related to imprint apparatuses and pressure control in imprint processes.
Frequently Updated Research: Researchers are constantly improving imprint technology for better results in various industries.
Questions about Imprint Apparatus: 1. How does the adjusting unit control the pressure difference between surfaces? The adjusting unit uses a mechanism to regulate the pressure in the imprint process.
2. What are the key advantages of using this imprint apparatus in semiconductor manufacturing? This imprint apparatus offers improved accuracy and efficiency in pattern transfer processes, crucial for semiconductor manufacturing.
Original Abstract Submitted
an imprint apparatus including a mold holding unit configured to hold a mold, an adjusting unit configured to adjust a pressure difference between a first pressure on a second surface on an opposite side of a first surface on which a pattern of the mold held by the mold holding unit is formed and a second pressure in a first space between a substrate and the first surface of the mold, and a control unit configured to control an imprint process, wherein the imprint process includes a separation process of separating the mold from a pattern made of a cured product of an imprint material on the substrate, and the control unit controls, in the separation process, the adjustment of the pressure difference by the adjusting unit so that the first pressure is smaller than the second pressure.
