Canon kabushiki kaisha (20240194715). SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM simplified abstract
Contents
SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM
Organization Name
Inventor(s)
Nobuyuki Endo of Fujisawa-shi (JP)
Tetsuya Itano of Sagamihara-shi (JP)
Kazuo Yamazaki of Yokohama-shi (JP)
Kyouhei Watanabe of Yokohama-shi (JP)
Takeshi Ichikawa of Hachioji-shi (JP)
SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194715 titled 'SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM
The patent application describes an apparatus where a first substrate with a photoelectric conversion element and a transistor gate electrode is stacked on top of a second substrate containing a peripheral circuit portion. The first substrate lacks a high-melting-metal compound layer, while the second substrate includes one.
- The apparatus involves stacking two substrates with different compositions.
- The first substrate houses a photoelectric conversion element and a transistor gate electrode.
- The second substrate contains a peripheral circuit portion.
- The absence of a high-melting-metal compound layer in the first substrate is a key feature.
- The presence of a high-melting-metal compound layer in the second substrate is another key feature.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Solar energy technology
Problems Solved: - Improved integration of different components in a compact space - Enhanced performance of photoelectric conversion elements
Benefits: - Increased efficiency in electronic devices - Cost-effective manufacturing process - Enhanced functionality of photoelectric conversion elements
Commercial Applications: Title: "Innovative Semiconductor Apparatus for Enhanced Electronic Devices" This technology can be utilized in the production of smartphones, digital cameras, and solar panels, among other electronic devices. It has the potential to revolutionize the semiconductor industry by improving the performance and efficiency of various electronic components.
Prior Art: Readers can explore prior patents related to semiconductor stacking technologies and photoelectric conversion elements to gain a deeper understanding of the innovation presented in this patent application.
Frequently Updated Research: Researchers are constantly exploring new materials and techniques to enhance the performance of semiconductor devices. Stay updated on the latest advancements in the field to leverage cutting-edge technologies for future innovations.
Questions about the Technology: 1. How does the absence of a high-melting-metal compound layer in the first substrate impact the overall performance of the apparatus? 2. What are the potential challenges in manufacturing and integrating the two substrates with different compositions?
Original Abstract Submitted
an apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. the first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.
