Canon kabushiki kaisha (20240194636). BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract
Contents
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
Organization Name
Inventor(s)
KENICHIRO Mori of Tochigi (JP)
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194636 titled 'BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
Simplified Explanation: The patent application describes a bonding apparatus that can bond a second object to one of multiple regions on a first object after performing a surface treatment on the second object.
- The apparatus includes a holder for the second object, a surface treatment device for activating the bonding surface of the second object, and a controller to manage the bonding process.
- The surface treatment device prepares the second object for bonding by activating its surface state.
- The controller then ensures that the second object is bonded to the desired region on the first object while being held securely by the holder.
Key Features and Innovation:
- Bonding apparatus for precise bonding of objects.
- Surface treatment device for activating bonding surfaces.
- Controller for managing the bonding process.
Potential Applications: This technology can be used in industries such as manufacturing, electronics, and automotive for precise bonding processes.
Problems Solved: This technology addresses the challenge of achieving accurate and secure bonding between objects.
Benefits:
- Enhanced precision in bonding processes.
- Improved adhesion between objects.
- Secure and reliable bonding results.
Commercial Applications: The technology can be applied in industries requiring precise bonding processes, such as electronics manufacturing and automotive assembly lines.
Prior Art: Readers can explore prior patents related to bonding apparatus and surface treatment devices to understand the evolution of this technology.
Frequently Updated Research: Stay updated on advancements in bonding technology, surface treatment methods, and industrial applications of similar innovations.
Questions about Bonding Apparatus: 1. What are the key components of a bonding apparatus? 2. How does surface treatment impact the bonding process?
Original Abstract Submitted
the present invention provides a bonding apparatus for performing a bonding process of bonding, to one of a plurality of regions in a first object to be bonded, a second object to be bonded, comprising: a holder configured to hold the second object; a surface treatment device configured to perform a surface treatment which includes activating a surface state of a target bonding surface of the second object held by the holder; and a controller configured to, after the surface treatment is performed for the second object by the surface treatment device, control the bonding process such that the second object is bonded to one of the plurality of regions in a state in which the second object is held by the holder.
