Canon kabushiki kaisha (20240190132). WAFER, AND LIQUID EJECTION CHIP simplified abstract
Contents
WAFER, AND LIQUID EJECTION CHIP
Organization Name
Inventor(s)
RYOTARO Murakami of Kanagawa (JP)
MANABU Otsuka of Kanagawa (JP)
WAFER, AND LIQUID EJECTION CHIP - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240190132 titled 'WAFER, AND LIQUID EJECTION CHIP
Simplified Explanation: The patent application describes a wafer and a liquid ejection chip designed to prevent a decrease in yield by incorporating an adhesive agent accumulation portion that prevents adhesive buildup in a gap between two substrates.
- The innovation involves the inclusion of an adhesive agent accumulation portion to prevent adhesive buildup in a gap between substrates.
- The accumulation portion ensures that the adhesive agent stays away from the bottom of a groove, maintaining the functionality of the wafer and liquid ejection chip.
Potential Applications: This technology can be applied in the manufacturing of wafers and liquid ejection chips used in various industries such as semiconductor manufacturing, printing, and medical devices.
Problems Solved: The technology addresses the issue of adhesive agent accumulation in the gap between substrates, which can lead to decreased yield and functionality of the wafer and liquid ejection chip.
Benefits: The technology ensures a higher yield and functionality of wafers and liquid ejection chips by preventing adhesive agent buildup, ultimately improving the overall quality of the products.
Commercial Applications: The technology can be commercially utilized in semiconductor manufacturing, printing technology, and medical device production to enhance the performance and reliability of wafers and liquid ejection chips.
Prior Art: Readers can explore prior art related to adhesive agent accumulation in wafer and chip manufacturing processes to gain a deeper understanding of the technological advancements in the field.
Frequently Updated Research: Stay updated on the latest research developments in wafer and chip manufacturing processes to incorporate cutting-edge technologies and innovations into production processes.
Questions about Wafer and Liquid Ejection Chip Technology: 1. What are the potential industrial applications of wafer and liquid ejection chip technology? 2. How does the adhesive agent accumulation portion prevent adhesive buildup in the gap between substrates?
Original Abstract Submitted
an object is to provide a wafer, and a liquid ejection chip which are capable of preventing a decrease in yield. to that end, an adhesive agent accumulation portion is provided at which an adhesive agent coming out of a gap between a first channel substrate and a second channel substrate accumulates and stays away from a bottom of a groove.
