Canon kabushiki kaisha (20240186157). APPARATUS INCLUDING A NON-CONTACT DIE HEAD AND A SUBSTRATE CHUCK AND A METHOD OF USING THE SAME simplified abstract
Contents
APPARATUS INCLUDING A NON-CONTACT DIE HEAD AND A SUBSTRATE CHUCK AND A METHOD OF USING THE SAME
Organization Name
Inventor(s)
Byung-Jin Choi of Austin TX (US)
APPARATUS INCLUDING A NON-CONTACT DIE HEAD AND A SUBSTRATE CHUCK AND A METHOD OF USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186157 titled 'APPARATUS INCLUDING A NON-CONTACT DIE HEAD AND A SUBSTRATE CHUCK AND A METHOD OF USING THE SAME
Simplified Explanation
Simplified Explanation: The patent application describes an apparatus and method for picking up a die from a source substrate using a non-contact die chuck and a non-planar chucking surface.
- The apparatus includes a pick-up head with a non-contact die chuck for holding a die, a substrate chuck with a non-planar chucking surface for holding a source substrate, and a substrate retention module that deforms the source substrate towards the substrate chuck.
- The method involves placing a source substrate on the non-planar chucking surface, picking up the die with the non-contact die chuck, and ensuring the source substrate only contacts spaced-apart portions of the die.
Key Features and Innovation:
- Non-contact die chuck for picking up a die without direct contact.
- Non-planar chucking surface for holding a source substrate.
- Substrate retention module for deforming the source substrate towards the chuck.
Potential Applications: This technology can be used in semiconductor manufacturing, electronics assembly, and other industries requiring precise die handling.
Problems Solved:
- Prevents damage to delicate dies during pick-up.
- Ensures accurate positioning of the die on the substrate.
Benefits:
- Improved precision in die handling.
- Reduced risk of damage to dies.
- Enhanced efficiency in substrate assembly.
Commercial Applications: The technology can be applied in semiconductor fabrication plants, electronics manufacturing facilities, and research institutions developing advanced microelectronics.
Prior Art: No specific prior art information is provided in the abstract.
Frequently Updated Research: There is no information on frequently updated research related to this technology.
Questions about Die Handling Technology: Question 1: How does the non-contact die chuck improve die handling efficiency? The non-contact die chuck eliminates the risk of damage to delicate dies during pick-up, ensuring precise and safe handling.
Question 2: What are the advantages of using a non-planar chucking surface for holding a source substrate? The non-planar chucking surface allows for better control and deformation of the source substrate, ensuring accurate positioning of the die during pick-up.
Original Abstract Submitted
an apparatus can include a pick-up head including a non-contact die chuck for holding a die; a substrate chuck having a non-planar chucking surface configured to hold a source substrate; and a substrate retention module that is configured to provide a force in a direction from the source substrate toward the substrate chuck, wherein the force is sufficient to deform the source substrate. a method of using the apparatus can include placing a source substrate along a non-planar chucking surface of a source chuck, wherein a die is associated with the source substrate; and picking up the die from the source substrate using a pick-up head having a non-contact die chuck, wherein before picking up the die, the source substrate contacts spaced-apart portions of the die, and the source substrate does not contact another portion of die between the spaced-apart portions of the source substrate.
