Canon kabushiki kaisha (20240157438). METHOD FOR MANUFACTURING MATERIAL LAYER, METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECT, MATERIAL-LAYER-FORMING APPARATUS, AND ADDITIVE MANUFACTURING SYSTEM simplified abstract
Contents
- 1 METHOD FOR MANUFACTURING MATERIAL LAYER, METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECT, MATERIAL-LAYER-FORMING APPARATUS, AND ADDITIVE MANUFACTURING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR MANUFACTURING MATERIAL LAYER, METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECT, MATERIAL-LAYER-FORMING APPARATUS, AND ADDITIVE MANUFACTURING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD FOR MANUFACTURING MATERIAL LAYER, METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECT, MATERIAL-LAYER-FORMING APPARATUS, AND ADDITIVE MANUFACTURING SYSTEM
Organization Name
Inventor(s)
Kenta Kubo of Kamakura-shi (JP)
Hiroshi Taniuchi of Yokohama-shi (JP)
METHOD FOR MANUFACTURING MATERIAL LAYER, METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECT, MATERIAL-LAYER-FORMING APPARATUS, AND ADDITIVE MANUFACTURING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240157438 titled 'METHOD FOR MANUFACTURING MATERIAL LAYER, METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECT, MATERIAL-LAYER-FORMING APPARATUS, AND ADDITIVE MANUFACTURING SYSTEM
Simplified Explanation
The method described in the patent application involves arranging particles on a base material to create a material layer. First particles are arranged in a pattern on the base material, and second particles are then arranged in regions where the first particles are not present. The second particles are applied by rubbing bearing materials against the base material.
- First particles are arranged in a pattern on a base material.
- Second particles are arranged in regions where the first particles are not present.
- Second particles are applied by rubbing bearing materials against the base material.
Potential Applications
This technology could be used in the manufacturing of advanced materials for various industries such as electronics, aerospace, and automotive.
Problems Solved
This method provides a precise way to create material layers with controlled particle distribution, which can improve the performance and properties of the final product.
Benefits
The method allows for the creation of material layers with specific particle arrangements, leading to enhanced material properties and performance.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of high-performance electronic devices that require precise material layers for optimal functionality.
Possible Prior Art
Prior methods of creating material layers may involve random particle distribution or less controlled techniques, which may not achieve the same level of precision as the method described in this patent application.
Unanswered Questions
How does this method compare to existing techniques for creating material layers?
This article does not provide a direct comparison to existing techniques for creating material layers, leaving the reader to wonder about the advantages and disadvantages of this new method.
What specific industries could benefit most from this technology?
While the potential applications are mentioned, the article does not delve into which industries could see the most significant impact from implementing this manufacturing method.
Original Abstract Submitted
a method for manufacturing a material layer includes a first step s of arranging first particles p in a pattern on a base material and a second step s of arranging second particles in regions in which the first particles p are not arranged on the base material . the second step s includes a step of rubbing bearing materials s that carry the second particles p against the base material on which the first particles p are arranged.
