Canon kabushiki kaisha (20240121885). WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract
Contents
- 1 WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
TOSHIYUKI Yoshida of Kanagawa (JP)
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240121885 titled 'WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE
Simplified Explanation
The patent application describes a wiring board with a wiring layer, shield layer, and insulating layer. The shield layer overlaps the wiring layer, and the insulating layer includes an end portion surrounded by insulation, located on at least one ground line, with a connection conductor line connecting the shield layer to the ground line.
- The wiring board includes a wiring layer, shield layer, and insulating layer.
- The shield layer overlaps the wiring layer in plan view.
- The insulating layer includes at least one end portion surrounded by insulation.
- The end portion is located on at least one ground line.
- A connection conductor line connects the shield layer to the ground line on part of the end portion.
Potential Applications
The technology described in this patent application could be applied in the manufacturing of electronic devices, such as circuit boards and other electronic components.
Problems Solved
This technology helps in reducing electromagnetic interference and improving signal integrity in electronic devices by providing a shield layer that overlaps the wiring layer and is connected to the ground line.
Benefits
The benefits of this technology include improved performance and reliability of electronic devices, reduced interference, and enhanced signal quality.
Potential Commercial Applications
The potential commercial applications of this technology could be in the telecommunications industry, consumer electronics, automotive electronics, and any other field that requires high-performance electronic devices.
Possible Prior Art
One possible prior art for this technology could be the use of shield layers in wiring boards to reduce electromagnetic interference and improve signal quality.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of implementing this technology compared to existing solutions. Further research or analysis would be needed to determine the cost implications of using this wiring board design.
What are the potential challenges in implementing this technology on a large scale?
The article does not address the potential challenges that may arise in implementing this technology on a large scale. Factors such as manufacturing processes, scalability, and compatibility with existing systems could present challenges that need to be explored further.
Original Abstract Submitted
a wiring board includes a wiring layer, a shield layer, and an insulating layer. the wiring layer includes at least one signal line and at least one ground line. the shield layer overlaps the wiring layer in plan view. the insulating layer is provided between the wiring layer and the shield layer. the insulating layer includes at least one end portion surrounded by the insulating layer. the at least one end portion is located on at least the at least one ground line. a connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.
