Boe technology group co., ltd. (20240244881). DISPLAY MODULE AND DISPLAY APPARATUS simplified abstract
Contents
DISPLAY MODULE AND DISPLAY APPARATUS
Organization Name
boe technology group co., ltd.
Inventor(s)
Xiaochuan Chen of Beijing (CN)
DISPLAY MODULE AND DISPLAY APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240244881 titled 'DISPLAY MODULE AND DISPLAY APPARATUS
The abstract of the patent application describes a display module with a bonding region that includes a first bonding component and a second bonding component. The first bonding component has first test pins and first function pins arranged in a first direction, while the second bonding component has second test pins and second function pins also arranged in the first direction. Test pin pairs and function pin pairs are formed by coupling the test pins and function pins, creating a pin row. Additionally, at least one first dummy pin is located on the outer side of the pin row in the first direction.
- The display module includes a first bonding component with first test pins and first function pins, and a second bonding component with second test pins and second function pins.
- Test pin pairs and function pin pairs are formed by coupling corresponding test pins and function pins.
- At least one first dummy pin is located on the outer side of the pin row in the bonding region.
- The arrangement of test pins, function pins, and dummy pins optimizes the bonding region for efficient connectivity.
Potential Applications: - This technology can be used in various display modules for electronic devices. - It can enhance the performance and reliability of display components in smartphones, tablets, and other gadgets.
Problems Solved: - Efficient organization of test pins, function pins, and dummy pins in the bonding region. - Improved connectivity and functionality of display modules in electronic devices.
Benefits: - Enhanced performance and reliability of display modules. - Streamlined design for better connectivity and functionality. - Potential cost savings in manufacturing processes.
Commercial Applications: Title: "Enhanced Display Module Bonding Technology for Electronic Devices" This technology can be utilized in the production of smartphones, tablets, and other electronic devices to improve display module connectivity and performance. It can be attractive to manufacturers looking to enhance the reliability and efficiency of their products in a competitive market.
Questions about the technology: 1. How does the arrangement of test pins, function pins, and dummy pins optimize the bonding region? 2. What are the potential cost-saving benefits for manufacturers implementing this technology?
Original Abstract Submitted
a display module has a bonding region, and includes a first bonding component and a second bonding component. the first bonding component includes first test pins and first function pins that are disposed in the bonding region and arranged in a first direction. the second bonding component includes second test pins and second function pins that are disposed in the bonding region and arranged in the first direction. the second test pins and the first test pins are coupled to constitute test pin pairs, the second function pins and the first function pins are coupled to constitute function pin pairs, and the test pin pairs and the function pin pairs constitute a pin row. the first bonding component further includes at least one first dummy pin disposed in the bonding region, and a first dummy pin is located on an outer side of the pin row in the first direction.
