Boe technology group co., ltd. (20240244747). WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME simplified abstract

WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME

Organization Name

boe technology group co., ltd.

Inventor(s)

Nianqi Yao of Beijing (CN)

Feifei Li of Beijing (CN)

Ce Ning of Beijing (CN)

Zhengliang Li of Beijing (CN)

Hehe Hu of Beijing (CN)

Jiayu He of Beijing (CN)

Jie Huang of Beijing (CN)

Kun Zhao of Beijing (CN)

Zhanfeng Cao of Beijing (CN)

Ke Wang of Beijing (CN)

WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240244747 titled 'WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME

The abstract of the patent application describes a wiring board with a base substrate and first connection pads containing electrical connection layers with main material layers and protective layers, including a first reference protective layer. The main material layer is made of copper, and the electrical connection layers include a first electrical connection layer capable of forming a first intermetallic compound with a first solder.

• The wiring board includes a base substrate and first connection pads.
• Each first connection pad has electrical connection layers with main material layers and protective layers.
• The protective layers include a first reference protective layer farthest from the base substrate.
• The main material layer is made of copper.
• The electrical connection layers contain a first electrical connection layer capable of forming a first intermetallic compound with a first solder.

Potential Applications: - Printed circuit boards - Electronic devices - Communication systems

Problems Solved: - Improved reliability of electrical connections - Enhanced performance of wiring boards

Benefits: - Increased durability - Better conductivity - Reduced risk of failure

Commercial Applications: Title: Advanced Wiring Boards for Enhanced Electronic Devices This technology can be used in the manufacturing of various electronic devices, leading to improved performance and reliability. The market implications include increased demand for high-quality wiring boards in the electronics industry.

Prior Art: Researchers can explore prior patents related to wiring boards, electrical connection layers, and protective layers to understand the evolution of this technology.

Frequently Updated Research: Researchers are constantly studying new materials and techniques to enhance the performance of wiring boards and electrical connections.

Questions about Wiring Boards: 1. How does the use of copper in the main material layer improve the performance of the wiring board? 2. What are the potential challenges in implementing this technology in mass production?

Original Abstract Submitted

a wiring board includes a base substrate and first connection pads disposed on the base substrate. the first connection pads each include electrical connection layer(s); each electrical connection layer includes a main material layer and protective layer(s) disposed on a side of the main material layer away from the base substrate; the protective layer(s) include a first reference protective layer, which is a protective layer farthest away from the base substrate in the protective layer(s); and a material of the main material layer includes copper. the electrical connection layer(s) includes a first electrical connection layer, which is an electrical connection layer farthest away from the base substrate in the electrical connection layer(s); and in protective layer(s) in the first electrical connection layer, at least a material of the first reference protective layer is capable of forming a first intermetallic compound with a first solder.