Boe technology group co., ltd. (20240234658). WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS simplified abstract

WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS

Organization Name

boe technology group co., ltd.

Inventor(s)

Jiayu He of Beijing (CN)

Yan Qu of Beijing (CN)

Ce Ning of Beijing (CN)

Zhengliang Li of Beijing (CN)

Hehe Hu of Beijing (CN)

Jie Huang of Beijing (CN)

Nianqi Yao of Beijing (CN)

Kun Zhao of Beijing (CN)

Feifei Li of Beijing (CN)

Qi Qi of Beijing (CN)

WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240234658 titled 'WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS

The abstract of the patent application describes a wiring board that includes a substrate, conductive pads, and at least one protective layer group. The conductive pads are located on the substrate, while the protective layer group is positioned on a side of the conductive pads away from the substrate. The protective layer group consists of an oxidation protective layer and a palladium alloy layer stacked on top of each other, with the oxidation protective layer closer to the substrate than the palladium alloy layer. The oxidation protective layer is made of a nickel-based alloy.

• The wiring board includes a substrate, conductive pads, and protective layers.
• The protective layer group consists of an oxidation protective layer and a palladium alloy layer.
• The oxidation protective layer is closer to the substrate than the palladium alloy layer.
• The oxidation protective layer is made of a nickel-based alloy.
• The wiring board design aims to protect the conductive pads from oxidation and other environmental factors.

Potential Applications: This technology can be used in various electronic devices and systems where protection against oxidation is crucial, such as in automotive electronics, aerospace applications, and consumer electronics.

Problems Solved: This technology addresses the issue of oxidation and environmental damage to the conductive pads on wiring boards, ensuring the reliability and longevity of electronic devices.

Benefits: The use of the protective layer group with an oxidation protective layer and a palladium alloy layer enhances the durability and performance of wiring boards, leading to more reliable electronic systems.

Commercial Applications: This technology can be applied in the manufacturing of electronic devices, circuit boards, and other electronic components to improve their resistance to oxidation and environmental factors, increasing the overall quality and lifespan of the products.

Questions about the technology: 1. How does the nickel-based alloy in the oxidation protective layer contribute to protecting the conductive pads? The nickel-based alloy provides a barrier against oxidation and other environmental factors, ensuring the longevity and reliability of the wiring board.

2. What are the potential cost implications of implementing this protective layer group in electronic devices? The cost of implementing this technology may vary depending on the scale of production and the specific requirements of the electronic devices, but the long-term benefits of improved reliability and performance may outweigh the initial investment.

Original Abstract Submitted

a wiring board includes a substrate, conductive pads and at least one protective layer group. the conductive pads are disposed on the substrate. the at least one protective layer group is disposed on a side of the conductive pads away from the substrate; a protective layer group includes an oxidation protective layer and a palladium alloy layer that are stacked, and the oxidation protective layer is closer to the substrate than the palladium alloy layer. a material of the oxidation protective layer includes a nickel-based alloy.