Boe technology group co., ltd. (20240224416). PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE simplified abstract

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE

Organization Name

boe technology group co., ltd.

Inventor(s)

Jiaxiang Zhang of Beijing (CN)

Jiuyuan Bai of Beijing (CN)

Xin Mu of Beijing (CN)

Mingqiang Wang of Beijing (CN)

Hongjin Hu of Beijing (CN)

Fei Li of Beijing (CN)

Yonglin Chen of Beijing (CN)

Kun Zuo of Beijing (CN)

Chang Wang of Beijing (CN)

Xin Bi of Beijing (CN)

Bin Zhang of Beijing (CN)

Seungyong Oh of Beijing (CN)

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240224416 titled 'PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE

The abstract describes a printed circuit board with a hard-board region and a soft-board region, as well as a method for fabricating the board and a displaying device. The board includes a base plate, adhesive film, covering film, and a first metal layer arranged in a layer configuration.

• The printed circuit board has a hard-board region and a soft-board region.
• The soft-board region is located at the periphery of the hard-board region.
• The board includes a base plate, adhesive film, covering film, and a first metal layer.
• A flow guiding groove is disposed on the covering film to guide overflowing adhesive.
• The flow guiding groove extends to the edge of the hard-board region.

Potential Applications: - Electronics manufacturing - Display devices - Consumer electronics

Problems Solved: - Efficiently guiding overflowing adhesive - Reducing the size of the printed circuit board - Preventing adhesive from flowing into unwanted areas

Benefits: - Improved manufacturing process - Enhanced product reliability - Cost-effective production

Commercial Applications: Title: Advanced Printed Circuit Board Technology for Electronics Manufacturing This technology can be used in various industries such as consumer electronics, telecommunications, and automotive for the production of high-quality printed circuit boards.

Prior Art: Prior art related to this technology can be found in patents and research papers on printed circuit board fabrication methods and materials.

Frequently Updated Research: Researchers are constantly exploring new materials and methods to improve the efficiency and reliability of printed circuit boards.

Questions about Printed Circuit Board Technology: 1. How does the flow guiding groove help in reducing the size of the printed circuit board? The flow guiding groove effectively guides overflowing adhesive to the periphery of the board, reducing the reserved overflowing-adhesive room and overall size of the board.

2. What are the potential applications of this advanced printed circuit board technology? This technology can be applied in various industries such as electronics manufacturing, display devices, and consumer electronics for improved product reliability and cost-effective production.

Original Abstract Submitted

a printed circuit board and a fabricating method thereof, and a displaying device. the printed circuit board includes a hard-board region () and a soft-board region (), the soft-board region () is located at the periphery of the first edge () of the hard-board region (), the printed circuit board within the hard-board region () includes a base plate (), and an adhesive film (), a covering film () and a first metal layer () that are arranged in layer configuration on one side of the base plate (), the adhesive film () is closest to the base plate (), a flow guiding groove () is disposed on the surface of the side of the covering film () that is closer to the adhesive film (), and the flow guiding groove () extends to a second edge () of the hard-board region (). by disposing the flow guiding groove on the surface of the side of the covering film that is closer to the adhesive film, and disposing that the flow guiding groove extends to the second edge of the hard-board region, the overflowing adhesive of the adhesive film can be effectively guided to flow to the periphery of the second edge via the flow guiding groove, and because the soft-board region is located at the periphery of the first edge, the method can effectively reduce the overflowing adhesive to flow to the soft-board region, reduce the reserved overflowing-adhesive room of the printed circuit board, and reduce the size of the printed circuit board.