Applied materials, inc. (20250105051). MODULAR SUBSTRATE SUPPORT ASSEMBLY
MODULAR SUBSTRATE SUPPORT ASSEMBLY
Organization Name
Inventor(s)
Arvinder Manmohan Singh Chadha of San Jose CA US
Vijay D. Parkhe of San Jose CA US
Christopher Laurent Beaudry of San Jose CA US
MODULAR SUBSTRATE SUPPORT ASSEMBLY
This abstract first appeared for US patent application 20250105051 titled 'MODULAR SUBSTRATE SUPPORT ASSEMBLY
Original Abstract Submitted
an electrostatic chuck assembly includes a first puck plate including one or more first functional elements, a second puck plate including one or more second functional elements, and an interface layer at least partially bonding the first puck plate and the second puck plate.