Applied materials, inc. (20240337449). REGENERATOR FOR FORELINE HEATING simplified abstract

From WikiPatents
Jump to navigation Jump to search

REGENERATOR FOR FORELINE HEATING

Organization Name

applied materials, inc.

Inventor(s)

Santosh S. Nesarkar of Bangalore (IN)

Harinath Reghunathannair of Bengaluru (IN)

Sathishkumar Kummamoorthy of Bangalore (IN)

REGENERATOR FOR FORELINE HEATING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240337449 titled 'REGENERATOR FOR FORELINE HEATING

The abstract describes a semiconductor processing system that provides regenerative heating to a foreline component in a plasma-based processing chamber. The system includes fluid paths for circulating a heat transfer fluid, vacuum systems for exhausting process gases, and a foreline regenerator with a regenerator shell surrounding the foreline vent.

  • The system components enable regenerative heating of the foreline component in a plasma-based processing chamber.
  • Fluid paths are designed to circulate a heat transfer fluid within the processing chamber.
  • Vacuum systems, including vacuum pumps and a foreline vent, exhaust process gases from the chamber.
  • The foreline regenerator features a regenerator shell with a heat transfer fluid input and output.
  • The heat transfer fluid input is connected to the output of the processing chamber.

Potential Applications: - Semiconductor manufacturing processes - Plasma-based material processing - Regenerative heating systems in industrial applications

Problems Solved: - Efficient heating of foreline components in semiconductor processing systems - Enhanced thermal management in plasma-based processing chambers

Benefits: - Improved temperature control in semiconductor processing - Increased efficiency and reliability of plasma-based material processing - Cost-effective regenerative heating solutions

Commercial Applications: Title: Regenerative Heating System for Semiconductor Processing This technology can be utilized in semiconductor manufacturing facilities, research laboratories, and industrial settings where precise temperature control is essential. The market implications include improved process efficiency, reduced energy consumption, and enhanced product quality.

Prior Art: Researchers can explore prior patents related to regenerative heating systems in semiconductor processing, plasma-based material processing, and thermal management technologies.

Frequently Updated Research: Researchers can stay informed about advancements in regenerative heating technologies, semiconductor processing systems, and plasma-based material processing techniques to enhance their understanding of the field.

Questions about Regenerative Heating Systems in Semiconductor Processing: 1. How does regenerative heating improve the efficiency of semiconductor processing systems? Regenerative heating helps maintain consistent temperatures in the processing chamber, leading to more precise control over the manufacturing process and reducing energy consumption.

2. What are the key components of a foreline regenerator in a semiconductor processing system? The foreline regenerator typically includes a regenerator shell, heat transfer fluid input and output, and connections to the processing chamber for efficient heat transfer.


Original Abstract Submitted

semiconductor processing systems and system components are described for providing regenerative heating to a foreline component. a system includes a plasma-based processing chamber. the processing chamber includes one or more fluid paths configured to circulate a heat transfer fluid. the system also includes one or more vacuum systems configured to exhaust process gases from the processing chamber, the one or more vacuum systems including one or more vacuum pumps and a foreline vent. the system includes a foreline regenerator. the foreline regenerator includes a regenerator shell at least partially surrounding the foreline vent, the regenerator shell including a heat transfer fluid input and a heat transfer fluid output, wherein the heat transfer fluid input is coupled to an output of the processing chamber.