Applied materials, inc. (20240258940). Electrostatic Chuck Having Extended Lifetime simplified abstract
Contents
Electrostatic Chuck Having Extended Lifetime
Organization Name
Inventor(s)
Mitsutoshi Fukada of Tokyo (JP)
Electrostatic Chuck Having Extended Lifetime - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258940 titled 'Electrostatic Chuck Having Extended Lifetime
The abstract of this patent application describes substrate supports for use in process chambers, including an electrostatic chuck with mesas and trenches, backside gas openings, and chucking electrodes.
- Electrostatic chuck with mesas and trenches
- Backside gas openings terminating in trenches
- Chucking electrodes in the electrostatic chuck
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Plasma etching processes
Problems Solved: - Improved substrate support for better process control - Enhanced uniformity in thin film deposition - Increased efficiency in plasma etching processes
Benefits: - Higher quality semiconductor devices - Increased productivity in manufacturing processes - Cost savings through improved process control
Commercial Applications: Title: Advanced Substrate Supports for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to improve process control and enhance the quality of semiconductor devices. It has the potential to increase productivity and reduce manufacturing costs.
Questions about Substrate Supports: 1. How does the design of the electrostatic chuck with mesas and trenches improve process control? - The design allows for better substrate adhesion and heat transfer, leading to improved process uniformity.
2. What are the advantages of having backside gas openings terminating in trenches? - The backside gas openings help with gas distribution and cooling, while the trenches provide additional support for the substrate.
Original Abstract Submitted
embodiments of substrate supports for use in process chambers are provided herein. in some embodiments, a substrate support includes: an electrostatic chuck (esc) having an upper surface and a plurality of mesas extending upward from the upper surface and a plurality of trenches extending downward from the upper surface and into the esc, wherein the esc includes a plurality of backside gas openings extending through the esc and terminating within at least some of the plurality of trenches; and one or more chucking electrodes disposed in the esc.
