Applied materials, inc. (20240258076). SPRAY-COATED ELECTROSTATIC CHUCK DESIGN simplified abstract
Contents
SPRAY-COATED ELECTROSTATIC CHUCK DESIGN
Organization Name
Inventor(s)
Tuck Foong Koh of Singapore (RS)
SPRAY-COATED ELECTROSTATIC CHUCK DESIGN - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258076 titled 'SPRAY-COATED ELECTROSTATIC CHUCK DESIGN
The patent application describes a substrate support with a metal body, lift pin holes, and a dielectric coating.
- Metal body with substrate face
- Plurality of lift pin holes with through holes and chamfer faces
- Dielectric coating on substrate face with supporting surface, thickness, and pattern
Potential Applications: - Semiconductor manufacturing - Printed circuit board production - Electronics assembly
Problems Solved: - Improved substrate support for delicate components - Enhanced precision in manufacturing processes
Benefits: - Increased efficiency in production - Higher quality end products - Reduced risk of damage to components
Commercial Applications: Title: Advanced Substrate Support Technology for Electronics Manufacturing This technology can be used in industries such as semiconductor manufacturing, electronics assembly, and printed circuit board production. It offers improved precision and efficiency in manufacturing processes, leading to higher quality products and reduced risk of damage to delicate components.
Questions about the technology: 1. How does the dielectric coating enhance the substrate support? The dielectric coating provides insulation and protection for the substrate, ensuring the integrity of delicate components during manufacturing processes.
2. What are the advantages of using lift pin holes with chamfer faces? The chamfer faces on the lift pin holes allow for a secure and precise mating with lift pin sleeves, ensuring stability and accuracy in the assembly process.
Original Abstract Submitted
embodiments of the disclosure include a substrate support including a metal body with a substrate face, a plurality of lift pin holes formed in the body, and a dielectric coating disposed on the substrate face of the body. each of the plurality lift pin holes includes a through hole and a chamfer face configured to mate with a lift pin sleeve. the dielectric coating includes a substrate supporting surface, a thickness, and a pattern disposed in the substrate supporting surface.
