Applied Materials, Inc. patent applications published on September 12th, 2024

Summary of the patent applications from Applied Materials, Inc. on September 12th, 2024

1. **Summary**: A series of recent patents by Applied Materials, Inc. focus on innovative technologies in semiconductor device manufacturing. These patents include a new etch process for creating vertical metal contacts on 2D materials without damage, lamp housings for process chambers, a method for gate structure formation using epitaxial growth, and a hydrogen plasma treatment for selective deposition in semiconductor device structures. These advancements aim to enhance device performance, improve manufacturing efficiency, and increase control over metal deposition processes.

2. **Key Points of Patents**:

  * New etch process for vertical metal contacts on 2D materials without damage.
  * Lamp housings for process chambers with tubes brazed between plates and a jacket.
  * Gate structure formation method using epitaxial growth and selective etching.
  * Hydrogen plasma treatment for selective deposition in semiconductor device structures.

3. **Notable Applications**:

  * Improved device performance and reliability in semiconductor manufacturing.
  * Enhanced efficiency and precision in metal film growth processes.
  * Potential applications in integrated circuit fabrication, nanotechnology research, and semiconductor device manufacturing.

Patent applications for Applied Materials, Inc. on September 12th, 2024

SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE (18281456)

Main Inventor

Thomas Werner Zilbauer

METAL ORGANONITRILE PRECURSORS FOR THIN FILM DEPOSITION (18195052)

Main Inventor

Thomas Joseph Knisley

ULTRA HIGH-K HAFNIUM OXIDE AND HAFNIUM ZIRCONIUM OXIDE FILMS (18119432)

Main Inventor

Harshil Kashyap

METHOD AND APPARATUS FOR PRECLEANING A SUBSTRATE SURFACE PRIOR TO EPITAXIAL GROWTH (18667515)

Main Inventor

Christopher S. OLSEN

FABRICATION TOOL CALIBRATION (18181491)

Main Inventor

Gautham Bammanahalli

PLASMA PROCESSING WITH INDEPENDENT TEMPERATURE CONTROL (18668480)

Main Inventor

Sandip NIYOGI

SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES (18181077)

Main Inventor

Laksheswar Kalita

Novel arc management algorithm of RF generator and match box for CCP plasma chambers (18118543)

Main Inventor

Tiefeng SHI

REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING (18666251)

Main Inventor

Mehdi Vaez-Iravani

PECVD OF SIBN THIN FILMS WITH LOW LEAKAGE CURRENT (18650014)

Main Inventor

Chuanxi YANG

HEATER ASSEMBLY WITH PROCESS GAP CONTROL FOR BATCH PROCESSING CHAMBERS (18665683)

Main Inventor

Akshay Gunaji

METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE (18666686)

Main Inventor

Nicholas Michael Bergantz

DIFFERENTIAL SUBSTRATE BACKSIDE COOLING (18206443)

Main Inventor

Yogananda Sarode Vishwanath

BACK SIDE DESIGN FOR FLAT SILICON CARBIDE SUSCEPTOR (18667082)

Main Inventor

Hui CHEN

HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES (18118017)

Main Inventor

Tsung-Han Yang

Methods For Forming Gate Structures (18371113)

Main Inventor

Nicolas Louis BREIL

Lamp Housing Braze Improvement for Semiconductor Rapid Thermal Processing (RTP) Chamber (18222979)

Main Inventor

Yao-Hung YANG

CONTACT CONSTRUCTION FOR SEMICONDUCTOR DEVICES WITH LOW-DIMENSIONAL MATERIALS (18597057)

Main Inventor

Hao-Ling Tang