Applied Materials, Inc. patent applications published on June 6th, 2024
Summary of the patent applications from Applied Materials, Inc. on June 6th, 2024
- Summary:**
Applied Materials, Inc. has recently filed patents for innovative technologies in the semiconductor industry. These patents include methods for fabricating 3D NAND flash memory structures with hollow epitaxial channels, forming dynamic random-access memory (DRAM) devices with pillars and caps, and coating micro-LED structures with reflective coatings. These advancements aim to enhance memory storage capacity, improve data transfer speeds, and increase the efficiency of electronic devices.
- Key Points of Patents:**
- Fabrication of 3D NAND flash memory structures with hollow epitaxial channels. - Formation of DRAM devices with pillars, caps, gates, and source/drains. - Coating LED epilayers with reflective coatings for improved light output.
- Notable Applications:**
- Memory storage devices - Solid-state drives - Display screens - Lighting systems - Semiconductor manufacturing - Electronics industry
By focusing on these key innovations, Applied Materials, Inc. aims to revolutionize the semiconductor industry and enhance the performance of electronic devices across various sectors.
Contents
- 1 Patent applications for Applied Materials, Inc. on June 6th, 2024
- 1.1 METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES (18442234)
- 1.2 MULTI-PULSE DEPOSITION PROCESSES (18074197)
- 1.3 AREA SELECTIVE DEPOSITION THROUGH SURFACE SILYLATION (17991931)
- 1.4 DETECTOR FOR PROCESS KIT RING WEAR (18401881)
- 1.5 METHOD OF BUILDING A 3D FUNCTIONAL OPTICAL MATERIAL STACKING STRUCTURE (18439434)
- 1.6 CONTROLLING LIGHT SOURCE WAVELENGTHS FOR SELECTABLE PHASE SHIFTS BETWEEN PIXELS IN DIGITAL LITHOGRAPHY SYSTEMS (18440727)
- 1.7 FLEXIBLE MULTI-LAYERED COVER LENS STACKS FOR FOLDABLE DISPLAYS (18437844)
- 1.8 EUV PHOTORESIST AND UNDERLAYER ADHESION MODULATION (18379106)
- 1.9 METHODS AND MECHANISMS FOR AUTOMATIC SENSOR GROUPING TO IMPROVE ANOMALY DETECTION (18075055)
- 1.10 SEMICONDUCTOR FILM THICKNESS PREDICTION USING MACHINE-LEARNING (18075216)
- 1.11 WORDLINE CONTACT FORMATION FOR NAND DEVICE (18525198)
- 1.12 MONOLITHIC MODULAR MICROWAVE SOURCE WITH INTEGRATED PROCESS GAS DISTRIBUTION (18419389)
- 1.13 THERMAL CHOKE PLATE (18076234)
- 1.14 Heated Pedestal With Impedance Matching Radio Frequency (RF) Rod (18074385)
- 1.15 METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER (18418930)
- 1.16 PASSIVE SEPARATION CASSETTE AND CARRIER (18073229)
- 1.17 WORDLINE CONTACT FORMATION FOR NAND DEVICE (18523401)
- 1.18 Method to Deposit Metal Cap for Interconnect (18074335)
- 1.19 HIGH-DENSITY MICRO-LED ARRAYS WITH REFLECTIVE SIDEWALLS (18413013)
- 1.20 DRAM TRANSISTOR INCLUDING HORIZONAL BODY CONTACT (18061733)
- 1.21 3D MEMORY INCLUDING HOLLOW EPITAXIAL CHANNELS (18525633)
Patent applications for Applied Materials, Inc. on June 6th, 2024
METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES (18442234)
Main Inventor
Xiangjin XIE
MULTI-PULSE DEPOSITION PROCESSES (18074197)
Main Inventor
Tianyi Huang
AREA SELECTIVE DEPOSITION THROUGH SURFACE SILYLATION (17991931)
Main Inventor
Xinke Wang
DETECTOR FOR PROCESS KIT RING WEAR (18401881)
Main Inventor
Yogananda Sarode Vishwanath
METHOD OF BUILDING A 3D FUNCTIONAL OPTICAL MATERIAL STACKING STRUCTURE (18439434)
Main Inventor
Michael Yu-tak YOUNG
CONTROLLING LIGHT SOURCE WAVELENGTHS FOR SELECTABLE PHASE SHIFTS BETWEEN PIXELS IN DIGITAL LITHOGRAPHY SYSTEMS (18440727)
Main Inventor
Thomas L. Laidig
FLEXIBLE MULTI-LAYERED COVER LENS STACKS FOR FOLDABLE DISPLAYS (18437844)
Main Inventor
Manivannan THOTHADRI
EUV PHOTORESIST AND UNDERLAYER ADHESION MODULATION (18379106)
Main Inventor
Zhiyu Huang
METHODS AND MECHANISMS FOR AUTOMATIC SENSOR GROUPING TO IMPROVE ANOMALY DETECTION (18075055)
Main Inventor
Peter J. Lindner
SEMICONDUCTOR FILM THICKNESS PREDICTION USING MACHINE-LEARNING (18075216)
Main Inventor
Nojan Motamedi
WORDLINE CONTACT FORMATION FOR NAND DEVICE (18525198)
Main Inventor
HsiangYu LEE
MONOLITHIC MODULAR MICROWAVE SOURCE WITH INTEGRATED PROCESS GAS DISTRIBUTION (18419389)
Main Inventor
JAMES CARDUCCI
THERMAL CHOKE PLATE (18076234)
Main Inventor
Vellaichamy Nagappan
Heated Pedestal With Impedance Matching Radio Frequency (RF) Rod (18074385)
Main Inventor
Yao-Hung YANG
METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER (18418930)
Main Inventor
Alan RITCHIE
PASSIVE SEPARATION CASSETTE AND CARRIER (18073229)
Main Inventor
James B. Exley
WORDLINE CONTACT FORMATION FOR NAND DEVICE (18523401)
Main Inventor
HsiangYu LEE
Method to Deposit Metal Cap for Interconnect (18074335)
Main Inventor
Ge QU
HIGH-DENSITY MICRO-LED ARRAYS WITH REFLECTIVE SIDEWALLS (18413013)
Main Inventor
Kai Ding
DRAM TRANSISTOR INCLUDING HORIZONAL BODY CONTACT (18061733)
Main Inventor
Sipeng Gu
3D MEMORY INCLUDING HOLLOW EPITAXIAL CHANNELS (18525633)
Main Inventor
HsiangYu LEE
