Applied Materials, Inc. patent applications published on June 27th, 2024
Summary of the patent applications from Applied Materials, Inc. on June 27th, 2024
1. **Summary**: Applied Materials, Inc. has recently filed patents related to innovative processes for memory device fabrication, forming subtractive metal semiconductor structures, and managing substrate deformation during processing. These patents introduce key features such as the formation of spacers around bit line contact pillars, degassing operations, and substrate support designs to prevent deformation. The notable applications of these patents include enhancing memory device performance, improving conductivity of metal interconnects, and ensuring substrate stability during processing.
2. **Key Points of Patents**:
* Formation of spacers around bit line contact pillars * Epitaxial growth of a doped layer on the memory stack * Self-aligned formation of the bit line with the active region * Degas operation, liner layer deposition, sputter operation, and metal layer deposition * Metal layer with low resistivity of about 30 μΩ·cm or less * Substrate support designed to prevent substrate deformation during processing * Support body with recessed surface and pocket surface * Plurality of supports protruding from the support body * Barrier with barrier supports to prevent deformation
3. **Notable Applications**:
* Semiconductor manufacturing * Nanotechnology research * Biomedical device fabrication * Enhanced memory device performance * Improved conductivity of metal interconnects * Substrate stability during processing.
Contents
- 1 Patent applications for Applied Materials, Inc. on June 27th, 2024
- 1.1 AMPOULE FOR A SEMICONDUCTOR MANUFACTURING PRECURSOR (18087434)
- 1.2 CLEANING SYSTEM FOR POLISHING LIQUID DELIVERY ARM (18597077)
- 1.3 PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE TUNGSTEN FEATURES (18557675)
- 1.4 TUNABLE HARDWARE TO CONTROL RADIAL FLOW DISTRIBUTION IN A PROCESSING CHAMBER (18540311)
- 1.5 CHAMBER ARCHITECTURE FOR EPITAXIAL DEPOSITION AND ADVANCED EPITAXIAL FILM APPLICATIONS (18602099)
- 1.6 MACHINE AND DEEP LEARNING TECHNIQUES FOR PREDICTING ECOLOGICAL EFFICIENCY IN SUBSTRATE PROCESSING (18087641)
- 1.7 Power Compensation in PVD Chambers (18089216)
- 1.8 Silicon (Si) Dry Etch for Die-to-Wafer Thinning (18086150)
- 1.9 RECONFIGURABLE MAINFRAME WITH REPLACEABLE INTERFACE PLATE HAVING REPLACEABLE CHAMBER PORTS (18389664)
- 1.10 SUBSTRATE SUPPORTS AND TRANSFER APPARATUS FOR SUBSTRATE DEFORMATION (18087255)
- 1.11 SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES (18595951)
- 1.12 HOLE-TYPE SADP FOR 2D DRAM CAPACITOR (18385945)
Patent applications for Applied Materials, Inc. on June 27th, 2024
AMPOULE FOR A SEMICONDUCTOR MANUFACTURING PRECURSOR (18087434)
Main Inventor
David Marquardt
CLEANING SYSTEM FOR POLISHING LIQUID DELIVERY ARM (18597077)
Main Inventor
Roy C. Nangoy
PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE TUNGSTEN FEATURES (18557675)
Main Inventor
Xi CEN
TUNABLE HARDWARE TO CONTROL RADIAL FLOW DISTRIBUTION IN A PROCESSING CHAMBER (18540311)
Main Inventor
Sanjeev Baluja
CHAMBER ARCHITECTURE FOR EPITAXIAL DEPOSITION AND ADVANCED EPITAXIAL FILM APPLICATIONS (18602099)
Main Inventor
Tetsuya ISHIKAWA
MACHINE AND DEEP LEARNING TECHNIQUES FOR PREDICTING ECOLOGICAL EFFICIENCY IN SUBSTRATE PROCESSING (18087641)
Main Inventor
Orlando Trejo
Power Compensation in PVD Chambers (18089216)
Main Inventor
Junjie PAN
Silicon (Si) Dry Etch for Die-to-Wafer Thinning (18086150)
Main Inventor
Guan Huei SEE
RECONFIGURABLE MAINFRAME WITH REPLACEABLE INTERFACE PLATE HAVING REPLACEABLE CHAMBER PORTS (18389664)
Main Inventor
Angela Rose Sico
SUBSTRATE SUPPORTS AND TRANSFER APPARATUS FOR SUBSTRATE DEFORMATION (18087255)
Main Inventor
Zhepeng CONG
SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES (18595951)
Main Inventor
He REN
HOLE-TYPE SADP FOR 2D DRAM CAPACITOR (18385945)
Main Inventor
Fredrick Fishburn
